Electronics Forum | Thu Oct 07 05:53:54 EDT 1999 | Wolfgang Busko
| | I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placeme
Electronics Forum | Thu Oct 07 03:08:57 EDT 1999 | Chris May
| I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement
Electronics Forum | Thu Oct 07 09:59:01 EDT 1999 | Dave F
| I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement
Electronics Forum | Thu Nov 16 22:01:06 EST 2017 | deanm
That model comes standard without bottom preheaters. Bottom preheaters are an option so I would think it is designed for general use unless you have some very thermally challenging boards. As long as you are within the process window, you'll be fine.
Electronics Forum | Wed Oct 06 21:45:20 EDT 1999 | John
I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement b
Electronics Forum | Fri Oct 08 16:48:24 EDT 1999 | Charles Morris
| I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement
Electronics Forum | Fri Nov 30 08:35:51 EST 2007 | stepheniii
We put glue on the bottom of the board that already has the topside SMT mounted. We populate the board. We put it through a cure profile. At this stage the topside components are soldered on. The bottom side components are glued on with NO solder on
Electronics Forum | Mon Nov 26 21:41:09 EST 2007 | davef
Shy: Oh, we NOW understand what you're asking. Sorry to be so dense. We agree that the standoff of component from the board could end-up being a little heigher than the pad height when using chipbonder adhesive. We rarely see a problem.
Electronics Forum | Mon Nov 26 22:05:34 EST 2007 | shy
currently i'm open my stencil aperture is 80% from the land pattern. is this will cause insufficient solder at the terminal component or not? the stencil thichness is 6mil and the board run using SMT pallet which i consider there will be no option f
Electronics Forum | Fri Nov 23 16:09:01 EST 2007 | davef
We're not real clear about what you're trying to discuss, because most capacitors are packaged in epoxy with a solderable termination on each end. But lets throw a couple of ideas at the wall and see what sticks. If this epoxy is: * From the capaci
