Electronics Forum | Fri Mar 23 23:26:40 EDT 2007 | mika
Hi, We are facing a complete new package type for us in our prototype production. RoHS LGA 36 Land Grid Array with 36 so called pads instead of bumps underneath. It is totatlly flat. This component is only 6.5 x 3.5 x 1.6 mm and we recieved them in a
Electronics Forum | Wed Nov 07 11:56:44 EST 2001 | mparker
Pad spacing is just one element to consider. Your pad spacing is determined by the pitch (center to center distance between the leads). There are several good resources to find the appropriate pitch per device. Search the archives here or refer to th
Electronics Forum | Thu Mar 25 23:23:00 EDT 2021 | llawrence
The QFP pitch is 0.5mm. Pad size is 1.475 x 0.3mm, and the new aperture size is 1.32 x 0.22mm. I'm not sure about whether or not it is lasered, but on the newly ordered stencil I selected the polishing option. Looks like the pad width is already 2/3
Electronics Forum | Thu Aug 12 22:38:44 EDT 1999 | Dave F
| Hello | | Having a problem with bridging on 20mil pitch qfp, only on the lead groups where squeegee goes over width of apertures. Using MPM sp-200 semi-auto, chem-etch stencil, 9-10mil width opening | 100 durometer blade. Getting "tails" on deposi
Electronics Forum | Wed Jan 27 08:39:07 EST 2016 | thefinder
Hi to all. i resolved my problem. I just select "LOAD" option the the program run.
Electronics Forum | Tue Dec 31 02:10:04 EST 2019 | sssamw
It looks like solder dross there or flux residue that not activated well. Your speed is 43cm/60s, wave width contact is 2cm, so dwell time is 2x43/60=1.43s, it's short also.
Electronics Forum | Mon Jan 15 15:40:18 EST 2007 | pyro747
Having problem with a 2X50 SCKT Strip PTH component(fine pitch) bridging on the wave. The PCB runs in wave pallets. Just wanting to know what successful findings have been done to eliminate bridging? Pallet angles? Copper or titanium inserts? Air kni
Electronics Forum | Wed Sep 02 08:44:50 EDT 1998 | Kelly Morris
| Hi, | We are having problem with yield loss due to electrical fail. Further investigation shows that the failure is due to solder bridging under BGA. Has been there any study or experience on how this could occur and what we can do to prevent it.
Electronics Forum | Wed Nov 11 10:08:38 EST 1998 | Magnus
| | Hi, | | We are having problem with yield loss due to electrical fail. Further investigation shows that the failure is due to solder bridging under BGA. Has been there any study or experience on how this could occur and what we can do to prevent
Electronics Forum | Fri Dec 27 02:11:31 EST 2019 | anteiv
Hello, We are having problems with SMD wave soldering (ERSA) used flux is BALVER ZINN 390-RX-HT https://www.balverzinn.com/tl_files/balverzinn/downloads/intern/TDB/PDS_390-RX-HT_EN.pdf https://www.balverzinn.com/tl_files/balverzinn/downloads/datenb
