Electronics Forum | Thu Mar 31 11:13:33 EDT 2022 | jzeivel
I forgot to mention in my original post, I actually replaced the theta belt and cleaned the head. All the tools rotate as they should. When I run the burn-in I get no errors. I can run the "test sub-systems" on the head in the service program and
Electronics Forum | Wed Jul 22 12:47:23 EDT 1998 | Earl Moon
| I'm trying to put together a set of design guides for use for new designers | in house or to be sent out for contracted layout work. I would like to start with a top ten list of things that will go wrong if rules aren't available. For example testp
Electronics Forum | Thu Sep 15 22:36:24 EDT 2005 | Ken
1. How did your customers preious supplier deal with this problem? 2. Why did they not alert you these sepcial needs during the quoting process? If they have special needs then relegate the parts to hand-stuff. Don't forget to adjust your price
Electronics Forum | Wed Apr 21 02:53:33 EDT 1999 | Raul N.
25 PPM)! | | | | 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? | | | | 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compe
Electronics Forum | Wed Aug 07 11:55:31 EDT 2002 | slthomas
Ron, have a look at http://www.fda.gov/cdrh/dsma/cgmphome.html It would be a nightmare, if your plant is not structured to support it. It's a huge pain in the fanny even when you (alledgedly) are. I'm not sure what you're pursuing, but if you're c
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
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