Electronics Forum | Tue Nov 14 19:59:22 EST 2006 | wchang
Heller 1800S Convection Reflow �� 1996 - 97 vintage �� Dimensions: length 150��, width 53", height 63", �� Number of forced convection zones - top 9, bottom 8 �� Cooling zones: 2 �� Conveyor width (m
Electronics Forum | Tue Sep 19 20:23:09 EDT 2000 | Arturo
99.70% mounting rates. 4.Make sure your machine can handle the recognition of this components (shape & height) usually height measuring(pick up error) is the biggest problem with resistors. 5.When mounting a real PCB you can have spacings up to 0.3mm
Electronics Forum | Thu Apr 25 05:56:32 EDT 2019 | pdrirrework
Hello, Have you had a look into our Focused IR Rework systems? A popular alternative to the convectional Rework systems. Our IR-E3M (Micro) would be perfect for your applciation and on one machine you will have the capability of Reworking BGAs up to
Electronics Forum | Wed Mar 15 04:36:16 EDT 2017 | Rob
@ Sr.Tech, Any voiding means that the part of the package under the void is not forming a solid thermal interface with the PCB, therefore it's heatsinking capability is reduced. With the drive for smaller packages with higher power handling capabil
Electronics Forum | Fri Feb 28 14:53:08 EST 2020 | rlising
Hi, I purchase a leadfree aven solder pot 300w. We are wanting to pre tin power and ground wires prior to soldering onto pcb. I have some anti-erosion flux cored wire solder from koki S03x7Ca-70m 1.6mm. Can this solder be used? If not what is t
Electronics Forum | Wed Mar 24 08:48:47 EST 1999 | Dave F
| I WORK FOR A SMALL TO MID-SIZE CONTRACT ASSEMBLY HOUSE. WE ARE TRYING TO FIND ANY SURVEYS OR STUDIES DONE ON THE USE OF BGA'S BY COMPANIES ON NEW DESIGNS. THE WAY EVERYBODY'S ALWAYS TALKING ABOUT BGA'S YOU WOULD THINK THAT THERE WILL BE NOTHING E
Electronics Forum | Thu Dec 08 07:55:16 EST 2005 | davef
Your understanding of the situation is correct. In both cases, you solder to the nickel. The gold [Au] protects the nickel from oxidation. When soldering, the gold moves into solution in the solder and forms an intermetallic compound [IMC] with th
Electronics Forum | Sun Aug 08 20:59:55 EDT 1999 | Dreamsniper
| | | What oven temperature should be used to reflow solder (Sn63Pb37) on a PC board (0.075" to 0.100" thickness) in 5 to 10 minutes? | | | | Profiling - tedious but important. As said, start with the paste manufacturers recomendation which is usua
Electronics Forum | Thu Oct 04 00:05:25 EDT 2018 | gaintstar
Flason SMT chip mounter Reflow Ovens: http://www.flason-smt.com/product/PCB-assembly-line-equipment-SMT-spare-parts-Dek-Motor-188962.html http://www.flason-smt.com/product/PCB-Conveyor-for-LED-Production-Line-SMT-Assembly-Line.html http://www.flason-
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