Electronics Forum | Sun Mar 22 15:29:01 EST 1998 | Michael Fogel
What is the right way to count the opportunities for defects in order to calculate the quality (in ppm) of SMT assembly processes as well as the quality of the PCB's? Please replay to: fogel_m@netvision.net.il or micha.fogel@ecitele.com
Electronics Forum | Thu Jul 18 12:28:56 EDT 2002 | Rance
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Electronics Forum | Wed Jan 16 11:20:52 EST 2002 | bentzen
Hi... We tend to do a lot of footprint calculating for new SMD components. But what about the amount of solder paste on the solder pads. The amount of solder alloy is of cause determined by the stencil aperture size, stencil thickness and the sold
Electronics Forum | Wed Jan 16 12:04:45 EST 2002 | dason_c
You can use the IPC-7525, Stencil Design Guidelines for start up.
Electronics Forum | Wed Jan 16 20:06:09 EST 2002 | davef
No, not as such. Consider: * Using the IPC calculator [free at http://www.ipc.org]. It allows you to consider / assess the amount of solder when designing pads. * Reviewing IPC-7525 - Stencil Design Guidelines. It gives general aperture guidelines.
Electronics Forum | Wed Jan 16 15:22:29 EST 2002 | Terry Burnette
In his book titled "Manufacturing Techniques for Surface Mount Assemblies" author R.J. Klein Wassink describes the relationship between solder land dimensions, component lead coplanarity, board warpage, solder volumes, and solder paste flux wetting b
Electronics Forum | Wed Mar 25 21:49:32 EST 1998 | Alberto Cervantes
| What is the right way to count the opportunities for defects in order to calculate the quality (in ppm) of SMT assembly processes as well as the quality of the PCB's? | Please replay to: | fogel_m@netvision.net.il | or | micha.fogel@ecitele.com
Electronics Forum | Tue Jun 29 11:46:36 EDT 2010 | davef
Prins: Everyone has equations. Here's one some people use: False call rate = [Number of defective boards, but good at inspection]/[Total number of boards produced] Why don't you ask the people [that calculated the numbers that confuse you] how the
Electronics Forum | Tue Mar 24 09:53:01 EST 1998 | Steve Schrader
| What is the right way to count the opportunities for defects in order to calculate the quality (in ppm) of SMT assembly processes as well as the quality of the PCB's? | Please replay to: | fogel_m@netvision.net.il | or | micha.fogel@ecitele.com Ch
