Electronics Forum: calculations (Page 30 of 87)

BGA Sphere Reflow

Electronics Forum | Thu Mar 02 15:12:50 EST 2000 | Robert Hartmann

To restate my question of earlier, if I have a .020" sphere before reflow, and my pad opening in the dielectric is .017", is there a rule of thumb to calculate the height of the sphere after reflow? We are using 62Sn/36Pb/2Ag spheres. This should h

Re: footprint formula

Electronics Forum | Thu Mar 02 11:57:25 EST 2000 | Wolfgang Busko

Did you try the online-calculator at the IPC-page. If you have the datasheet it should be no problem. For wave soldering I can�t tell if it�s suitable for that particular part, but you should add extra pads at the end of each column to solderbridging

Re: footprint formula

Electronics Forum | Fri Mar 03 06:41:09 EST 2000 | jacqueline coia

I have tried the IPC calculator and they do not have this type of component registered. When trying to select 'other' on menu, no connection can be made. The polarity if the QFP has not been decided yet (pre-PCB design) the pitch size of the componen

Re: footprint formula

Electronics Forum | Fri Mar 03 10:12:41 EST 2000 | Dave F

Jack: "Calculator/Other" works for me. But you know what, I'll bet they block Scotts from using it, because they're reputed to be too cheap to buy the standard. ;-) (Your component is in the standard. ;-)) If you can't get the supplier to help and

Re: footprint formula

Electronics Forum | Wed Mar 08 09:54:11 EST 2000 | Jacqueline Coia

Finally got using the calculator guys, (used another server connection). Not sure about the data that is entered for 'solder joint analysis', any helpful hints? To touch on the subject of Scots people being 'cheap', I cant understand these rumours, w

Re: Industry Standards

Electronics Forum | Wed Mar 01 17:07:50 EST 2000 | Dave F

Brian: Several things: � Many CAD systems offer compliant pad design libraries � Look at IPC-SM-782 "Surface Mount Design And Land Pattern Standard" � Some times, component manufacturers have the best information about pad designs for their compone

Re: SMT Yields- Dean please explain-thanks.

Electronics Forum | Mon Feb 21 12:02:58 EST 2000 | K. Ckak

Hi Dean, Can you please tell me how we could incorporate DPU to DPMO? Also, can you please explain the deviation factor DPU * deviation factor = DPMO ? Should we take dollar value or number of joints? Explain with calculations if you please. Thanks

CPH

Electronics Forum | Thu Feb 10 00:08:46 EST 2000 | Hon Choi

Dear all, We haven't been using CPH (chips per hour) as an index of our production capability, but it seems more and more attractive as a basis by which we can compare the capability of different plants producing different products. Are there any o

Re: solder balling

Electronics Forum | Mon Aug 07 16:23:34 EDT 2000 | Ramon I Garcia C

Hi!!! Thanks frieds for your advising, I have a MPM UP2000, I'm going to chek the humidity control, too I'll chek the profiles again, this plant it's located close to the beach about 1/2 mile from. However if you know some table to calculate t

Re: OSP surface finish.

Electronics Forum | Wed May 24 12:15:53 EDT 2000 | Wolfgang Busko

Bill, I would assume that the stencil rests on the soldermask especially when you use a metallblade. If you know the difference in height between soldermask and land you could take that into your volume calculation when figuring out your desired ste


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