Electronics Forum: casing (Page 88 of 247)

Board baking after washing machine

Electronics Forum | Fri Nov 02 12:01:26 EST 2001 | mparker

I have two cases where I must bake after DI wash. The moisture entrapment is specifically within microprocessor sockets. Without air gun blow out and baking, oxidation occurs that causes flaky contacts for the PGA. We will bake for 2-3 hours @ 60C. O

Reflow X2

Electronics Forum | Thu Nov 01 04:32:52 EST 2001 | wbu

Jonathan, we do that all day. We do not use different pastes nor do we glue components nor do we run different profiles. Depends on what is meant by "small components". In our case it�s all that "bird seed" up to SO8. That will work for more parts.

Solder Balls @ the Wave Solder Process

Electronics Forum | Tue Nov 27 13:36:22 EST 2001 | jmathis

Solder balls on the topside of our wave solder boards is a real issue. We have found that during the wave solder process, solder will enter through the via holes in the form of solder balls. It seems to be related to flux captured in the vias and o

Non-wettig on chip cap.

Electronics Forum | Fri Dec 07 08:32:56 EST 2001 | scottdavies

I have used Multicore MP-100 and Heraeus F380 pastes for a while, and experienced very few dry joint problems. May be worth checking if the pad size and/or spacing are to the correct specification for the components. Check the date codes on the comp

reflow temp/ic damage

Electronics Forum | Mon Jan 28 07:40:40 EST 2002 | cnotebaert

Yes and Yes, Your solder supplier should recomend a profile (standard profile) in most cases you can follow it. Of course you should be running a thermal profile of each board type to verify it is within the specified temp rang. You should also chec

Kester 959 Flux : Clogging filter ?

Electronics Forum | Mon Feb 18 09:49:04 EST 2002 | Ashok Dhawan

Anyone using Kester 959 flux on Spray fluxer ? I noticed a black coating on filter element which is installed in supply line ( inside flux tank). The filter element is immersed into flux tank. It is turning blackish due to deposit of flux rosin ?? T

Solder paste for RF boards

Electronics Forum | Mon Apr 15 21:27:16 EDT 2002 | djarvis

Everything we do is RF and have had no problems in the last 7 years with - Indium NC-SMQ92J, Sn63 Pb 37, 90.25% Metal, -325+500 mesh. Stencils are always 0.005" thick. However I will qualify that by adding we are an OEM and each new product may requi

IC in Stick

Electronics Forum | Tue May 07 07:41:33 EDT 2002 | Sir Alexandr

Hello ! That was an one of our troubles. But we decidet it. Our way : 1. Vibrofeeders of Phillips may be ajusted for special ironrails , horisontallylairs , so IC goes permanently and correctly, also we create some acceptable subfeeder for Phillips

place BGA by FUJI IP3

Electronics Forum | Thu Apr 25 21:58:54 EDT 2002 | Gang shen

thank all of your kind help.today I set the camera gain and offset same as the camera2,the gain is 180,and the offset is 105. First the vision process is failed to pass ,later I found the size of the BGA ball in the screen is so smaller than the rea

Quad Machines? Good Points / Bad Points

Electronics Forum | Thu May 02 10:27:18 EDT 2002 | BTaylor

I have used Quad/ Now Tyco since the early 90s starting with the 4c then on to the QSA-30s, APS-1, and now the Meridian 1010. We have six machines in a very small area and place over 10 million components per month. As others have said the service is


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