Electronics Forum | Thu Mar 15 09:28:19 EDT 2007 | jseagle
I have seen this when the fiducials are not spaced far enough in the X and Y.
Electronics Forum | Thu Mar 15 19:48:10 EDT 2007 | vshan
how far do you think it should be rgd vshan
Electronics Forum | Wed Mar 14 20:06:54 EDT 2007 | vshan
Hi All i need some help here, currently experiencing connector leg shifted due to solder paste shifted from pad ~0.3mm. I did adjusted the reverse/forward X, Y and titah but still shifted. Product : flex circuit with 28 connector on the panel. Each
Electronics Forum | Mon Mar 19 07:50:59 EDT 2007 | realchunks
Hi Vshan, If 3 legs are on the pads and 3 legs are off the pads, AND your paste is the same, I'd say your boards are made wrong.
Electronics Forum | Fri Mar 16 23:38:36 EDT 2007 | mika
I don't understand so please explain in more detail. You say ~0.3mm shifted. In what direction is the paste shifted? is it shifted the very same directions on all panels? Only on this product or even with regular pcb:s? What is the size of the panel
Electronics Forum | Fri Mar 16 13:47:56 EDT 2007 | ck_the_flip
Another thing to look out for... Flex circuits, if not fixtured properly tend to move around and, well, "flex" during screen printing. At another place I worked, we fixtured the flex circuit on a SMT pallet on the corner tooling pins to "stretch"
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
Electronics Forum | Mon Sep 27 11:40:50 EDT 2004 | grayman
use water soluble solder paste is the cure for your problem. but if you insist of using NC change your pogo pins to pointed pins.
Electronics Forum | Fri Sep 10 09:39:32 EDT 2004 | Bryan Sherh
Dears, I've a board with OSP surface finish,and I planned to print solder paste on the test pad for easy ICT, because the probe can't reach the OSP covered pad.But to my surprise,after reflow there's much flux residue on top of test pad(or solder) an
Electronics Forum | Mon Sep 13 18:34:31 EDT 2004 | russ
Use Water soluble if you can, if not I would try the Indium SMQ NC paste, this residue stays soft. I would also change ICT probes to the "drill type". Russ
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