Electronics Forum | Tue Jun 06 13:41:16 EDT 2000 | Charles Harper
I would like to refer you to John W. Kratz, author of Chapter 8, as listed at the top of the forum. John is the outstanding specialist in this subject area.
Electronics Forum | Wed Dec 15 12:41:49 EST 2004 | DasonC
Check IPC-A-610C Chapter 12.1, Staking Adhesive
Electronics Forum | Fri Aug 23 16:02:37 EDT 2002 | davef
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies; John Lau; McGraw-Hill Professional; ISBN: 0071351418; 2000 * Chapter 6. Flip Chip on Board with Conventional Underfills. * Chapter 7. Flip Chip on Board with No-Flow Underfills. * C
Electronics Forum | Tue Nov 25 17:43:09 EST 2003 | Gabriele
Try to see J-STD-001 Chapter 8.Cleaniness Requirements. Also you could info also on ASTM D5127-99. Rgds
Electronics Forum | Thu Jul 06 20:46:17 EDT 2000 | Dave F
Mark: An area of increasing interest to all of us. From the SMTnet "Terms & Definitions" (or whatever they call it) Globtop. Encapsulant. Encapsulating. Encapsulation. Potting. Enclosing an article in an envelope of adhesive or encapsulating co
Electronics Forum | Thu Mar 28 20:06:53 EDT 2024 | cbeneat
What type head is it? Try changing the internal filters. If it is a low number head, ie: 1-4 on an 8, 1-6 on a 12 or 1-8 on a 16. These can be accessed by pushing the head to the opposite table for removal. Chapter 11, section 11-6 page 11-6.3 in mai
Electronics Forum | Wed Aug 30 03:58:26 EDT 2006 | Ola
Yes you do need a different upline interface card. This information should be in Your Technical Reference Manual, Electronics enclosure chapter 6? Y2 Enclosure, card position X8 Downline and X9 upline: Part No Description. 112045 Base Card
Electronics Forum | Wed Jun 07 11:25:23 EDT 2000 | Dave F
In the portion of Chapter 1 on Flip Chips, Ken Gallio states (1.8.2.1) "tin/lead solder leaching or dissolving gold and form metal compounds, called dendrites, that greatly reduce joint reliability because of high brittleness." What is the compositi
Electronics Forum | Mon Jan 17 07:48:37 EST 2011 | davef
SMTnet Newsletter Aug 1999 by B Ellis Title: A Comprehensive Guide to the Design and Manufacture of Printed Board Assemblies Vol. 1 & 2 Editor: William Macleod Ross Publisher: Electrochemical Publications Limited, GB This two-volume work can p
Electronics Forum | Fri Dec 06 10:16:57 EST 2002 | davef
Bare board cleanliness is still primarily measured by resistivity of solvent extract (ROSE) using instruments such as Omegameters and Zero Ions. What is considered as "acceptable" cleanliness varies between specification and from company to company.
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