Electronics Forum | Fri Jan 11 06:38:58 EST 2019 | tirthkar8980
what is the standard for pad size of SMD chip type components
Electronics Forum | Sat Jan 12 01:25:53 EST 2019 | tirthkar8980
Respected sir, thank you so for useful information. Thank you, Tirthkar
Electronics Forum | Fri Jan 11 14:45:03 EST 2019 | davef
Here's a presentation on IPC-7351C [ http://www.ocipcdc.org/archive/What_is_New_in_IPC-7351C_03_11_2015.pdf ] by Tom Hausherr, CEO & Founder of PCB Libraries, Inc. PCB Libraries helps support SMTnet.com
Electronics Forum | Wed Jul 01 04:54:28 EDT 2015 | jvercamm
hi, the last post on pad cratering dates from 2012. We have (likely similar) problems with a RoHS 783 solder ball BGA size 29x29mm^2 (organic package BT), pitch is 1mm and solder ball diam is 0.5mm the field failure is after 12 months, almost exclu
Electronics Forum | Fri Dec 07 08:32:56 EST 2001 | scottdavies
I have used Multicore MP-100 and Heraeus F380 pastes for a while, and experienced very few dry joint problems. May be worth checking if the pad size and/or spacing are to the correct specification for the components. Check the date codes on the comp
Electronics Forum | Mon Dec 10 13:56:51 EST 2001 | slthomas
1) The additional activity of the OA flux probably took care of the oxydation. How do you plan on taking care of the presence of conductive and corrosive residues from it now, though? You're not supposed to wash those parts with water. 2) The tomb
Electronics Forum | Thu Jun 22 11:42:29 EDT 2000 | Chrys Shea
Sal, Silly question: Were the parts skewed before they went into the oven? I've chased down a few similar reflow problems in my lifetime, only to find out it was a pick and place problem. Wrong nozzle size, bad nozzle, feeder not advancing all
Electronics Forum | Wed Feb 16 20:51:37 EST 2000 | Jim
We have to place some LCC208's. The terminations are flush with the underside of the package, on an 0.5mm pitch. The pads on the board are flat tin. We'd like to get the part up in the air a little to provide some clearance for cleaning. Is there a w
Electronics Forum | Wed Feb 16 20:51:37 EST 2000 | Jim
We have to place some LCC208's. The terminations are flush with the underside of the package, on an 0.5mm pitch. The pads on the board are flat tin. We'd like to get the part up in the air a little to provide some clearance for cleaning. Is there a w
Electronics Forum | Fri Jan 23 10:39:35 EST 2004 | patrickbruneel
Kris, I assume with voids you mean acceptable solder coverage of pad and lead. As Dave mentioned I also have not seen any specific studies on voids, but workman ship standards exist about acceptable coverage of pad and lead (both consumer and MIL)
