Electronics Forum | Thu Jan 11 11:29:58 EST 2018 | mohammad
I use this one Chip Quik Inc. SMD291AX250T3
Electronics Forum | Tue Jan 03 11:30:13 EST 2012 | ppcbs
Try using Chip Quik to reduce the heat required for component removal. Along with your bottom pre-heater, use a temperature controlled hot air system to help heat up top side for component installation. http://www.pcb-repair.com/products.htm
Electronics Forum | Wed Feb 07 13:44:09 EST 2007 | dsoohoo
After some precursory experimentation, I am planing on employing a form of low melting temp solder for use in reworking some very dense, copper core PCB's, both SMT and THT, which were originally mounted with 63/37 solder. The main problem with the
Electronics Forum | Sat Jun 05 13:38:22 EDT 2021 | ppcbs
For Linear Tech LGA's we solder bump the LGA using a .30mm solder ball then reflow with a tacky flux. This will provide a void free solder joint and adds a little height to the solder joint in case you use a flux that you want to clean from under th
Electronics Forum | Tue Mar 23 23:17:12 EDT 2021 | llawrence
Hello everyone, I work for a company that, up until now, has done everything using through-hole components. This has been fine for years, but we have been pushed into the world of surface mount manufacturing by a new product that is far cheaper and
Electronics Forum | Mon Mar 25 21:50:10 EST 2002 | davef
Some of this was copped from Fred. There are numerous package types that now fall under the rubric of land grid array [LGA]. Land grid devices [ie, Bumped Chip Carrier� [BCC], LGA, Quad Flat-pack No-lead [QFN], MicroLeadFrame�, etc] are essentially
| 1 |
