Electronics Forum | Mon Feb 14 12:07:47 EST 2000 | Dave F
Leslie: Product screens and tests of prototypes and test vehicles should be tailored for the specific goal and product. I caution your use of equations and test condition information without specific use environments and design conditions. Lawyer:
Electronics Forum | Fri May 31 10:35:46 EDT 2002 | dason_c
I think that the IPC spec only apply to the MSD. I had a paper from Lucent and forwarded by Francois Monette, please aware that the first 2 hours, the moisture doesn't bake out from the assembly/component and result show that it is increase the weigh
Electronics Forum | Tue May 21 20:27:05 EDT 2002 | davef
No N2. We could not fix a benefit for N2 in our minds. Just fold the excess bag material over to expell most air and then seal the bag. [Have you assessed the benefit of N2?] F Monette can tell you stories about little versus more pressure. If he
Electronics Forum | Mon Feb 04 20:27:25 EST 2002 | davef
1,000 G ohm ||100 M ohm Dielectric Constant ||9.5 ||4.9 Loss Factor ||5 - 20 ||200 * E indicates exponent Continuing: * Spacing between same plane traces effect the electical parameters between the traces. * Dielectric materials used between diff
Electronics Forum | Fri Jul 04 21:09:04 EDT 2003 | ramanandkini
I have a CEM-1 PCB board with 35 microns copper. This is PCB is finished with SMOBC+HALS. We do solder SMT LEDs, but till date we do not have problems that you have listed. The LEDs are good & bright. It even passed high & low temp cycle tests (-40 t
Electronics Forum | Thu Sep 06 13:19:36 EDT 2001 | mparker
The main criteria is at what frequency is the RF operating? If it's in the microwave region, forget no-clean. Low frequencies - 0 to 100 MHz, probably ok. Beyond that, it's application specific. Depends on components used and circuit design. The p
Electronics Forum | Tue Jul 01 21:06:12 EDT 2003 | ramanandkini
My customer just assembles it to the car. We want to use the silica gel to avoid moisture since the assembled part (clock) reach him via ship after 50 days. The electronic circuit board has no conformal coatings at present. We are working on that. Ou
Electronics Forum | Thu May 07 20:28:35 EDT 2009 | davef
From our notes, the following is a series of snips from: "Copper Dissolution in Tin" LJ Turbini, PhD, adjunct faculty member, University of Toronto, Materials Science and Engineering, SMT 2/07 As the solder becomes molten, copper from the board diff
Electronics Forum | Tue Apr 27 09:31:45 EDT 1999 | Robert L. McCallum
On circuit board assemblies first pass yields need to be above 98%, if a supplier is below this level it is a indication that: he has poor control of the manufacturing process; Poor component selection (price over quality; excepted a poor design from
Electronics Forum | Thu May 26 07:50:33 EDT 2011 | scottp
What process steps have been completed before the cross-section? What type of devices have solder cracks? Are the cracks found after just normal processing or after some type of validation testing? It is very unlikely to be a heating/cooling issue
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