Electronics Forum | Fri Oct 08 17:12:31 EDT 1999 | Dave F
| Hi, | | Does anybody know what is the minimum gold plating thickness on the PCB goldfinger required by the industrial specifications - IPC, Bellcore, etc. Where can I find the information? Appreciate for the help! | | Thanks, | Tony | Hi Tony:
Electronics Forum | Fri Jul 11 02:42:40 EDT 2008 | aj
Thanks Dave, IPC-6012 states min at 0.05um. Has this been a update or is it for a different class? thanks, aj...
Electronics Forum | Mon Aug 16 13:18:46 EDT 2004 | davef
You bet our reponse changes. Q2R: Hard gold thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2R: This is a hard gold spec?? It looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. The gol
Electronics Forum | Wed Dec 15 21:29:34 EST 2004 | davef
We�d say that it�s incorrect that ENIG solderability protection cannot be steam aged. It�s true the immersion tin and silver cannot be steam aged. We believe that most of the issues surrounding the poor performance of ENIG after steam aging is attr
Electronics Forum | Fri Feb 01 08:35:18 EST 2002 | gregers
PWB shelf life: HASL---3mth ENTEK-- 2mth Before using expired PWB, it is suggested to go thru HASL or ENTEK angain. Ask your VDR to serve this. Re immersion Au, mostly when the thickness under 3u"(micro pores present), the surface gold will serve a
Electronics Forum | Mon May 09 18:14:54 EDT 2016 | davef
I asked Randi Gates, Electrolube Marketing to join us to help with the conversation. Taking a step back from the Electrolube question, I could envision a 10 minute soak in DI water stripping the gold from a an ENIG board, you know, depending on the
Electronics Forum | Tue Jan 19 11:12:41 EST 1999 | Dave F
| | | | | Folk's, | | | | | | | | | | I'm looking for information of how long you cna store a gold finish PCB before building it. I know there are problems with the gold disappearing into the underlying nickle over time / temperature etc but exactly
Electronics Forum | Wed Jan 30 02:50:33 EST 2019 | electronics101
Hi Steve Thanks for coming back to me, you are correct IPC class 3 is required. We are getting great wetting onto the device but not as per IPC 3 with the wetting rising about 0.25mm. I am questioning whether it is actually possible with such a (re
Electronics Forum | Sun Aug 08 04:36:02 EDT 1999 | Brian
Dave Frankly, I think you may be barking up the wrong tree. Like DaveF, I suggest that the process would be horrendously expensive with masking and so on. The $64,000 question is whether what you propose will serve any useful purpose. I venture to
Electronics Forum | Tue Apr 19 13:23:33 EDT 2016 | vchauhan
We are using Vicor SMT J-Lead VI Chip which is big component on the bottom side. The manufacturer recommends to have 6 mil stencil but the customer required 10 mil stencil. The PWB has gold contacts on both sides. We noticed some mini solder splashes
