Electronics Forum | Tue Jul 31 18:49:20 EDT 2001 | arsmoriendi
i have a problem with some units that had one capacitor only soldered in one side, the geometry of the capacitor is 0805, our product during his life suffer a lot of stress (due temperature or vibration), some of those units are already with the cost
Electronics Forum | Mon Feb 24 11:02:42 EST 2003 | Claude_Couture
Every time this problem was brought to me, handling was the problem. Make sure to: 1- track the exact place the components are lost, i.e.: visually inspect the pcb before and after each step in your assembly line. 2- if step one does not pin point t
Electronics Forum | Mon Sep 11 20:30:21 EDT 2000 | Dave F
Don�t kid yourself Sal, either: * Components were always falling off your board, but someone just noticed it ... OR * Something in your process HAS changed ... OR * Both Voids are primarily process indicators. I won't comment on the cause of the
Electronics Forum | Wed Jun 27 11:59:55 EDT 2007 | samir
*Preheat zone *Maximum slope is a time/temperature relationship that measures how fast the temperature on the printed circuit board changes. The ramp�up rate is usually somewhere between 1.0 �C and 3.0 �C per second, often falling between 2.0 �C and
Electronics Forum | Fri Nov 03 12:06:07 EST 2006 | mika
Interesting. We are also facing this problem due to; once in a while a matrix tray is mishandled by the operators and as a result those very, very expensive components falls to the floor and the columns got bent. We manage somethime to "straighten th
Electronics Forum | Tue Jun 20 14:19:04 EDT 2000 | Chrys Shea
Hi Mike, The Hadco design guidelines are really good - I was just there. To expand on what Dave said, scoring is an option, but I've never had good luck with it, myself. The scores are either too shallow, and I can't break the boards easily enough
Electronics Forum | Tue Oct 12 05:09:13 EDT 1999 | Brian
| | | | | | | Can anyone tell me the formula/method to determine | | | | | | | the amount of weight that solder's surface tension can support. | | | | | | | (ie: Maximum weight of components soldered onto a bottom side | | | | | | | of a board during
Electronics Forum | Mon Oct 11 12:49:11 EDT 1999 | John Thorup
| | | | | | Can anyone tell me the formula/method to determine | | | | | | the amount of weight that solder's surface tension can support. | | | | | | (ie: Maximum weight of components soldered onto a bottom side | | | | | | of a board during a top s
Electronics Forum | Sat Oct 09 10:30:24 EDT 1999 | bix
| | | | | Can anyone tell me the formula/method to determine | | | | | the amount of weight that solder's surface tension can support. | | | | | (ie: Maximum weight of components soldered onto a bottom side | | | | | of a board during a top side refl
Electronics Forum | Sat Oct 09 09:18:21 EDT 1999 | Dave F
| | | | Can anyone tell me the formula/method to determine | | | | the amount of weight that solder's surface tension can support. | | | | (ie: Maximum weight of components soldered onto a bottom side | | | | of a board during a top side reflow on a
