Electronics Forum: components (Page 1013 of 1140)

Re: Adhesion loss on passives over wave

Electronics Forum | Fri Mar 19 07:24:38 EST 1999 | John

| | | | Hi folks, | | | | | | | | I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diameter and

Re: Transient Voltage Suppressors

Electronics Forum | Tue Mar 16 05:11:47 EST 1999 | Charles Stringer

| | AVX and a few other companies make these chip transient voltage suppressors (TVS) parts that are a real *PAIN* to use. According to AVX: | | "Due to the semiconducting nature of the doped Zinc Oxide (ZnO) ceramic material, SMT TransGuard

Re: Hi-Speed SMT manufacturing

Electronics Forum | Sun Jan 31 14:34:50 EST 1999 | Dean

| SMT Mfg. Equipment: Fuji CP-6/IP-3 - but please all hi-speed chip placer users input are appreciated !! | | The company that I work for is a C/M which offers both consignment but mostly turnkey work. I am currently running 3 Fuji lines. All parts

Re: Hi-Speed SMT manufacturing

Electronics Forum | Mon Feb 01 17:48:36 EST 1999 | E.

| | SMT Mfg. Equipment: Fuji CP-6/IP-3 - but please all hi-speed chip placer users input are appreciated !! | | | | The company that I work for is a C/M which offers both consignment but mostly turnkey work. I am currently running 3 Fuji lines. All

Re: Hi-Speed SMT manufacturing

Electronics Forum | Wed Feb 17 22:55:25 EST 1999 | Dave Kalen

| | SMT Mfg. Equipment: Fuji CP-6/IP-3 - but please all hi-speed chip placer users input are appreciated !! | | | | The company that I work for is a C/M which offers both consignment but mostly turnkey work. I am currently running 3 Fuji lines. All

Re: Hi-Speed SMT manufacturing

Electronics Forum | Wed Aug 04 01:19:30 EDT 1999 | oscar

| | SMT Mfg. Equipment: Fuji CP-6/IP-3 - but please all hi-speed chip placer users input are appreciated !! | | | | The company that I work for is a C/M which offers both consignment but mostly turnkey work. I am currently running 3 Fuji lines. All

Re: reject percentage of assembled circuits after initial test?

Electronics Forum | Fri Jan 08 13:22:11 EST 1999 | Earl Moon

| This is a question for those of you who actually assemble components onto a board. | Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your overall qua

Re: reject percentage of assembled circuits after initial test?

Electronics Forum | Fri Jan 08 21:46:49 EST 1999 | Dean

| | This is a question for those of you who actually assemble components onto a board. | | Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your overall

Re: Component Packaging Trends

Electronics Forum | Thu Oct 15 17:14:50 EDT 1998 | Justin Medernach

| Hi Folks, | As I travel our industry it seems to me the trend is to move from finner and finner pitch QFP's to array packages (BGA's, CSP's, etc.). Do you folks see the same trend? What is the finest pitch QFP package you have used in your process?

Re: Universal GSM/Response No. 2

Electronics Forum | Fri Oct 02 07:26:50 EDT 1998 | smd

I didn't use my real name because I don't want to get bombed with phone calls and emails. We are an OEM looking to put in a SMT line soon. Is this GSM a decent machine? How much does it cost? | | Also and info on decent screen printers and reflo


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