Electronics Forum | Fri Jul 28 09:24:17 EDT 2017 | jpepke468
A lot of our PCB's are being damaged by our water cleaner, it is a Steolting Triton, and I beleive it is due to the drying section in the machine. The air its blowing on the boards is flipping the boards around on the conveyor and smashing small deli
Electronics Forum | Fri Mar 26 17:12:17 EST 2004 | ben
I have recently encountered a new pcb design with a very high density of components on either side of the pcb. One of the suggested "fixes" is to use the smt pads as vias i.e. the via will be drilled thorough the centre of the smt pad. My concern i
Electronics Forum | Wed Feb 01 22:27:16 EST 2006 | KEN
Many relays use soldered post coil terminatins inside the relay. In one case many years ago I found the SMT relay manufacturer used eutectic solder inside their hermetic relay. The SMT relay would fail because the solder balled up on the post, woul
Electronics Forum | Tue Jan 31 15:51:04 EST 2006 | russ
Relays huh? I can tell you from previous experience that relays are not a good heat gun candidate. Did you check how long this part can withstand the 240? I do not know what the 4 setting is on a liester but it is probably well in excess of the 24
Electronics Forum | Tue Jan 31 15:40:44 EST 2006 | mgdrouin1
Comp is relay. I've pulled the spec. Max 240. Using Leister h/g with manual temp settings from 1-6 (20 - 600C)set by the operator. Gun was set to setting 4. They are using the heat gun to reflow the solder after SMT but before wave. High fai
Electronics Forum | Mon Jan 12 13:15:18 EST 1998 | Yves Trudell
In general terms, guidelines for moisture sensitive devices (MSDs) say that you shouldn't put a component through reflow after it has reached its exposure limit with respect to moisture absorption. When using an automated hot air rework tool to remo
Electronics Forum | Thu Aug 03 12:51:20 EDT 2006 | Ofer Cohen
I'd appreciate your support in the following issue: A significant batch of PCBs failed on de-lamination. The failure was identified, of course, only after the assembly. There is a big variety of components (BGA 1mm, BGA 0.8 mm, FQPs and other SMT co
Electronics Forum | Thu Aug 03 12:51:59 EDT 2006 | Ofer Cohen
I'd appreciate advise in the following issue: A significant batch of PCBs failed on de-lamination. The failure was identified, of course, only after the assembly. There is a big variety of components (BGA 1mm, BGA 0.8 mm, FQPs and other SMT componen
Electronics Forum | Wed Oct 18 07:51:14 EDT 2006 | davef
Look here: http://www.circuittechctr.com/ As a low cost approach, use copper foil purchased from a stained glass window hobbyist shop. Cut foil pieces to size with a sharp knife. Epoxy the pieces in place of the damaged pads. Tin and then solder th
Electronics Forum | Thu Jul 19 04:38:33 EDT 2007 | chrispy1963
I took a Lead Free troubleshooting Class at SMTA in Chicago last September taught by Phil Zarrow. He told us during that seminar that its not a good practice to cross contaminate Leaded and Lead Free components but IF it is necesary than using lead
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