Electronics Forum | Thu Jan 03 13:52:35 EST 2002 | Luis F. Otero
We have a TP-18 and had the same problem. If you have time send me an e-mail at luis.otero@conexant.com and i'll call you or call me at 915-780-5504. Luis F. Otero
Electronics Forum | Mon Jun 17 21:31:23 EDT 2002 | davef
Most of our discussions here on SMTnet have focused on underfills. With transfer molding, voiding near the die, wire bonds, or leads contribute to more failures than others. Try: * Tim Chen, Cookson Semiconductor 800-223-9057 * Ron Molnar, Abpac In
Electronics Forum | Wed Apr 05 22:31:51 EDT 2000 | Dave F
Robert: Out of curiosity, by "BT" do you mean: � Bismaleimide triazine, the stuff used to increase the tg of resins used in some BGA interposers. � British Telecommunications plc, the guys with bad teeth. � BrookTree, the RAMDAC supplier, that�s par
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