Electronics Forum | Tue Mar 14 16:26:45 EST 2006 | patrickbruneel
BeCu is not solderable without plating Cu, Sn, Ag, Ni etc. The solder joint will only be as strong as the bond strength of the solderable plating to the BeCu Pat
Electronics Forum | Mon Sep 09 21:54:01 EDT 2013 | mandysmile
Hi, rod, The exposed copper area you could do with ENIG. It is with good solderability.
Electronics Forum | Thu Mar 23 12:21:11 EST 2006 | Rob
Well, at least it gives you an option if you ever have a heavy fall & land on your head. Could you not modify an ESD coat & add some copper welding rod to give it that flying in the wind look? You could even decorate it with some disposable heal st
Electronics Forum | Wed Mar 05 09:34:32 EST 2003 | HAROLD LICHT
WE HAVE A NEED TO BOND SOME LOW TEMPERATURE LED'S TO A THIN CIRCUIT BOARD LAMINATED TO A HEAT SINK. HAS ANYONE USED AN ULTRASONIC WELDER TO WELD COPPER GUL WING LEADS TO A COPPER PAD USING ULTRASONICS? IF NOT HAS ANYONE USED RESISTANCE SPOT WELDING
Electronics Forum | Mon Aug 27 08:03:32 EDT 2007 | davef
Actually, you will be soldering and wire bonding to the palladium layer, so we should have asked if you checked that layer, rather than the nickel. We not sure of the source of the copper that your see on EDX. It's possible copper from the pad migra
Electronics Forum | Tue Mar 13 20:47:39 EDT 2018 | davef
I think of palladium coated copper with gold flash (CuPdAu) as bond wire used in chip attach. Look here: https://www.heraeus.com/media/media/het/doc_het/products_and_solutions_het_documents/bonding_wires_documents/fact_sheets/Factsheet_PdFlash.pdf
Electronics Forum | Sun Apr 05 00:23:53 EDT 2020 | researchmfg
1. To protect the nickel and copper under gold plating from oxidization before soldering. Gold plating can extend the PCB self-life and improve the solderability for 2nd re-flow. 2. Provide a good bonding strength. For Chip on Board process that Gol
Electronics Forum | Thu Jun 17 16:18:22 EDT 1999 | Earl Moon
| | Has anyone had problems with the Weller MT 1500 IRON/TIP solder station? | | Please advise your problem and resolution. | | | | ddj | | 6/16/99 | | | I don't like to use the needle tips (MT2 series), but the rest of the tips work fine. The MT2
Electronics Forum | Wed Aug 15 16:08:02 EDT 2001 | davef
A properly formed solder connection is stronger than the underlying copper to laminate bond. Measuring pad peal strength: IPC-TM-650, Method 2.4.21 for multiple solderings, use Method 2.4.8 for copper peal using an Instron machine. Typical requiremen
Electronics Forum | Fri Aug 17 01:40:55 EDT 2001 | V.RAMANAND KINI
We are in the watch & clock Business. We have a Watch IC chip that has to be wirebonded using Ultrasonic aluminium wedge bonder. The wire dia is 1.25mil. The PCB is made of G10 Glass epoxy copper clad laminate. The copper thickness is 18 microns. The
