Electronics Forum | Wed Sep 27 08:28:05 EDT 2006 | AR
Hi all All you wave soldering people, have you had any trouble in keeping the copper level of your SAC solder pots under control? How do you combat the gradual rise of copper contents owing to dissolution from through-hole component leads etc.?
Electronics Forum | Mon Feb 06 13:00:51 EST 2006 | amol_kane
Hi all, I just wave soldered 40 boards (20 if Imm Sn and 20 of Imm Ag) using SAC 305 (in this case the wave machine manufacturer (electrovert) suggested the alloy too). plan to carry out x-sectioning to see the results. overall, just from the visual
Electronics Forum | Tue Mar 18 17:23:40 EDT 2008 | dkntb
Any member in here has experienced of copper migration from BGA's substrate to PWB during eutectic soldering reflow process, which resulted in brittle solder joints??? We have one customer notified us that our PBGA with DSOP substrate having copper m
Electronics Forum | Mon Oct 21 18:31:45 EDT 2002 | MikeF
Mike, If your wave solder machine doesn't have enough preheat capacity you can put the board in an oven and warm it part way before you put it into the wave solder machine. This works best with a spray fluxer, as a warm board will collapse the foam
Electronics Forum | Wed Jul 27 09:47:01 EDT 2005 | GCampbell
CEMCO Uk have done testing using SACX0307, SAC305 and Sn/Cu/Ni. The copper dissolution tests (report available) conducted at CEMCO showed that the lowest copper erosion rate was achieved by SACX0307. Regards Gerry
Electronics Forum | Mon Jul 11 19:32:27 EDT 2005 | fctassembly
Yes, there have been many issues with the fast dissolution of copper by the SAC305 alloy. In fact, there are companies who have disqualified it for repair operations due to loss/thinning of the pads. SN100C dissolves copper much slower than SAC305 an
Electronics Forum | Fri Jul 08 18:41:50 EDT 2005 | GS
2 micromillimeters have been "eaten" reducing so the amount of copper thikness. I know they are going to test also HASL by using SACX307. It will be good to know if some one already made HASL tests by using SN100C (N-Superior) Many Thanks GS
Electronics Forum | Wed Jun 29 17:58:12 EDT 2005 | GS
Hello, in Europe (SN100C sold by Balver Zinn) several solder pots have been filled by this alloy. On the paper I heard talking very well in terms of performance and good price, but not data are available ( as I know) about performance and if r
Electronics Forum | Thu Jul 28 09:47:06 EDT 2005 | fctassembly
Hello Carl, The main reason there is little information on lead free soldering to ENIG is because most of the lead free soldering to date has been Japanese consumer products. To keep costs down, the major surface coating used has been OSP copper. It
Electronics Forum | Mon Aug 30 16:10:10 EDT 1999 | Dave F
| I have looked through the IPC web page and surfed to frustration. Can somebody give me a lead? | Brian: We don't use an etched board. We use a special stencil, described below and print on bare copper laminate. 3 Solder Wetting Test. Recogniz
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