Electronics Forum: cpk procedure (Page 1 of 1)

Reflow Oven Cp & CpK Test at customer place

Electronics Forum | Sat Feb 10 06:35:42 EST 2007 | Charls

Hi Friends, We would like to know what is the procedure to test Cp & Cpk on Reflow oven at customer place .

CPk using glass slugs?

Electronics Forum | Thu Feb 25 10:11:08 EST 1999 | Joe Cameron

Read an earlier thread about using glass slugs to determine placement CPk. Can it actually be done this way? What's the procedure? Be interesting to know 'cause if it's feasible, I'd probably get myself a kit. None of us here are stat's experts a

Re: CPk using glass slugs?

Electronics Forum | Thu Feb 25 22:01:52 EST 1999 | Chris G.

| Read an earlier thread about using glass slugs to determine placement CPk. Can it actually be done this way? What's the procedure? Be interesting to know 'cause if it's feasible, I'd probably get myself a kit. None of us here are stat's experts

Re: Equipment Selection - Maintenance History

Electronics Forum | Wed Oct 28 16:54:17 EST 1998 | Dave F

| Sirs, | | what would be a good way to judge the reliability/robustness of a stencil printer or chip shooter? | | Does any equipment supplier specify detailed maintenance schedules? Is there a source of machine failure data (MTBF, etc.)?

Stencil life

Electronics Forum | Thu Jun 07 01:22:41 EDT 2018 | buckcho

Hello, the colleagues are all right. What I did in addition to show customers and quality that we either need or dont need a stencil: 1. Made a procedure - in there i defined 50 000 cycles and then the stencil has to be checked by me. In the checks

Re: Paste Question!

Electronics Forum | Thu Jan 06 17:56:14 EST 2000 | Brian W.

I agree with Dave that passte volume is the most preferable criteria. However, you need to determine what you will accept and what your process is capable of. You need to define the process parameters, put procedures in place to control them, reduc

SPC for SMT

Electronics Forum | Fri Mar 07 08:47:45 EST 2003 | msivigny

Hello Peter, In reflow, running a profile and collecting thermal data does not necessarily make it easy to calculate and determine machine capability. On the contrary to your desires of simplifying the process, determining machine capability on an ov

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