Electronics Forum: criterias (Page 1 of 55)

IPC Standard for Acceptable and Reject Criteria

Electronics Forum | Wed Nov 03 09:42:31 EST 2004 | dramos1

Hi Simon, Thanks for the immediate reply. We really appreciate it very much. Currently, we are using Class 2 for the visual inspection criteria of our telecom boards. In IPC-A-610 Rev. C criteria, there are TARGET, ACCEPTABLE and REJECT criterias.

SMT Visual Inspection Criteria

Electronics Forum | Thu Dec 08 03:15:36 EST 2005 | khp_armin

Please give me information on Visual Inspection Criteria for solder appearance

Inspection criteria on PIH parts

Electronics Forum | Wed Aug 04 17:16:13 EDT 2004 | Richard

Can anyone comment on inspection criteria for PIH applications. I'm of the opinion that the inspection criteria used for wave soldered joints should be used for PIH. Some colleagues believe that a bottom side fillet is not necessary since the solde

CCGA solderability criteria

Electronics Forum | Thu Jun 19 05:14:18 EDT 2008 | sckee

Hi, Need help on the CCGA solderability criteria.I've actually run a NPI that using CCGA yet not sure whether the solderability is accepted or not. The alloy of the column is 80/20 and the surface of the solder joint is not smooth and shine. By chec

QFN Side fillet

Electronics Forum | Sat Jul 20 14:55:55 EDT 2019 | davef

IPC-A-610F 8.3.13 Bottom Termination Components (BTC) ... Thermal plane void criteria shall be established between the manufacturer and user IPC-A-610F, 8.3.14 Components with Bottom Thermal Plane Terminations ... Thermal Plane Void Criteria -

Re: Typical Failure Rates

Electronics Forum | Tue Sep 26 10:04:52 EDT 2000 | Chris May

Darren, You may/will get people referring you to the archives, which is a fair shout. But, by "failure rate" you probably mean "acceptance". What is good and bad depends upon your own acceptance criteria (IPC-610 ?). Find out what the acceptance c

Scrap criteria

Electronics Forum | Tue Sep 20 14:48:04 EDT 2005 | OEM Manufacturer

$1500 each

BGA Inspection Criteria

Electronics Forum | Wed Dec 06 15:22:07 EST 2000 | Christopher Lampron

Does anyone know of documented inspection criteria for inspecting BGA's post reflow? (e.g. void percent, alignment, etc..) Any help would be greatly appreciated Thanks In Advance Chris

Re: BGA Inspection Criteria

Electronics Forum | Wed Dec 06 20:56:19 EST 2000 | Dave F

Why sure, we use WI-10-02-05, BGA Inspection Criteria, bgainsp.doc, 00, 9/15/99, based on an article in Evaluation Engineering Magazine, Sept �99, p130.

Looking for Filled via -- Embedded within pad - criteria

Electronics Forum | Thu Sep 16 10:11:58 EDT 2004 | cburress

davef, Thanks for the reply. I've talked with IPC and they are currently reviewing this and attempting to compose some criteria. They "informally" recommend no greater than .002" also.

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