Electronics Forum | Tue Dec 15 00:09:26 EST 2009 | isd_jwendell
Which paste are you referring to?
Electronics Forum | Tue Apr 12 08:25:43 EDT 2005 | davef
Q1 Can anyone explain to me what is the clean and non clean solder? A1 The trend away from CFCs has lead many users to evaluate switching to no-clean soldering processes. The term "no-clean" is actually a common misnomer when used to describe a flux
Electronics Forum | Fri Jul 09 10:45:34 EDT 2004 | davef
Start at Dan Terstegge's excellent jump site: http://www.smtinfo.net/Db/_Pin%20In%20Paste%20Soldering.html
Electronics Forum | Tue Apr 13 14:56:51 EDT 2004 | russ
in a thread titled ".5mm bga" there is a reference to a paste by alpha that is no-clean and is supposed to be made specifically for this situation. I suppose that increasing the pad dimension to .012" is out of the question? Russ
Electronics Forum | Sun May 05 17:27:32 EDT 2013 | davef
Here’s a Tweet that I made here [http://blogs.smtnet.com/smt/smt-placement/ipc-apex-2013-my-tweets/ ] … Hisco’s computer controlled frig for managing solder paste inventory … way more sophisticated than that old white frig. Davef I receive no benefi
Electronics Forum | Wed Jul 20 05:49:45 EDT 2011 | kenneth0
I think you are referring to nano coatings. Try google nano coated stencils
Electronics Forum | Tue Oct 06 17:36:20 EDT 2020 | hearsehauler
Have used stencils for low volume paste printing for 18 yrs. New job uses jet printing (MY500). But machine is limited to .33mm dot size. Parts used here have pad sizes that are .25mm or smaller, so paste touches between pads when printed. Thankfully
Electronics Forum | Wed Feb 25 21:47:24 EST 2015 | dinhhuunam
Hi Marshall Bartel, SJ INNOTECH Printer is Best solution & Service for you ! HP-520S/HP-620S/HP-760S/HP-1000S Printing (±0.0125mm) Repeatability (±0.01mm) 0.3 Pitch QFP, 0402 Chip, Ø0.2 MBGA Speed/pressure control by printing section (5 sections) V
Electronics Forum | Tue Jul 19 12:10:04 EDT 2005 | CLampron
Sr. tech, The mount tool test position is what I am refering to. The function of this is to determine the placement plane of the board. The mount plane will change if the board is thicker so thickness is relavent. regards Chris
Electronics Forum | Wed Mar 23 05:17:23 EDT 2011 | arwankhoiruddin
Hi All. I want to know what is the IPC/JEDEC standard for solder paste printing defects. From the brochures of SPI Machines, the recognized defects are excessive, insufficient, misalignment, no solder, bridging, and solder shape error. What document
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