Electronics Forum | Wed Apr 25 13:45:41 EDT 2012 | davef
Failure analysis, Cross section Cross section equipment sectioning equipment suppliers: * Leco; 3000 Lakeview Ave, St. Joseph, MI 49085; leco.com * Struers; 24766 Detroit Rd, Westlake, OH 44145; 888-787-8377 F440-871-8188 struers.com * Buehler Worldw
Electronics Forum | Mon Mar 24 09:09:40 EDT 2008 | jdumont
Hello all, we have been seeing a lot of issues with broken or open vias on a couple of our bare boards. We have two vendors make these for us and the issue is only with one vendors boards. We have stopped using them until we can figure out what is go
Electronics Forum | Mon Feb 23 21:27:20 EST 1998 | fxb
| I have the following questions with regards to the solder printing stencil design : | 1) Is the Electro-polish process recommended for laser cut stencil ? | 2) Should the aperture walls be slanted at an angle or straight wall, i.e. trapezoidal |
Electronics Forum | Thu Jan 22 20:10:19 EST 1998 | Raymond
I have the following questions with regards to the solder printing stencil design : 1) Is the Electro-polish process recommended for laser cut stencil ? 2) Should the aperture walls be slanted at an angle or straight wall, i.e. trapezoidal openin
Electronics Forum | Tue Jan 27 08:08:51 EST 1998 | Jon Medernach
| I have the following questions with regards to the solder printing stencil design : | 1) Is the Electro-polish process recommended for laser cut stencil ? | 2) Should the aperture walls be slanted at an angle or straight wall, i.e. trapezoidal |
Electronics Forum | Wed Aug 18 21:04:45 EDT 2004 | davef
Sectioning equipment suppliers: Leco, Struers, Buehler General automatic and manual sectioning methods: IPC-TM-650 2.1.1 and 2.1.1.2
Electronics Forum | Thu Aug 19 10:20:27 EDT 2004 | Cal
DF-Indy: Are you thinking of a SEM as well?
Electronics Forum | Fri Aug 20 12:29:43 EDT 2004 | df_indy
Thanks for the input. We currently do not have plan for SEM.
Electronics Forum | Mon Feb 08 09:03:49 EST 2010 | woodsmt
Looking for methods for detecting BGA microcracks without cross sectioning. Currently evaluating a new package and will be putting together a thermal stress eval. We would like to perform intermediate inspections for cracks. Once all cycles are don
Electronics Forum | Mon Jan 26 08:58:05 EST 1998 | Mike McMonagle
| I have the following questions with regards to the solder printing stencil design : | 1) Is the Electro-polish process recommended for laser cut stencil ? | 2) Should the aperture walls be slanted at an angle or straight wall, i.e. trapezoidal |
