Electronics Forum | Thu Aug 11 08:23:29 EDT 2005 | jbragg
Hi Peter, I'm not sure where you're located, but I work for Celestica in our Component Failure Analysis and Reliability Testing Lab in Toronto Ontario Canada. We are an idenpendent lab with full FA component, assembly and PWB capabilities and would
Electronics Forum | Tue Aug 23 13:25:10 EDT 2005 | MMurison
MUAnalysis is an independent lab for Component Failure Analysis and Reliability Testing in Ottawa, Ontario Canada. We also would be pleased to discuss your analysis needs. We also perform all non-destructive testing, e.g. visual, x-ray, C-SAM, el
Electronics Forum | Wed Mar 04 13:06:45 EST 2015 | cyber_wolf
A full blown analysis could become very expensive. There are many test that can be performed. 3D acoustic microscopy, X-ray, Dye and pry,and I'm sure the list goes on. Typically, a micro-cross section report of the BGA solder joints will show you w
Electronics Forum | Thu Sep 20 15:05:20 EDT 2007 | jax
You can specify the prepreg thickness in the stackup. Once you have specified it somewhere, make your PCB manufacturer build to it... and prove it through cross-section analysis. Depending on the Board cost, we require a cross-section and analysis d
Electronics Forum | Tue Oct 24 11:00:56 EDT 2006 | SWAG
I'm not sure why that was done. They based that decision on what they saw in cross-sectional analysis of the failures.
Electronics Forum | Tue Mar 25 10:08:20 EDT 2008 | bandjwet
Along the lines of this topic..... Does anyone know about the going rate for a cross sectional analysis including the report from 3rd party labs for this service?
Electronics Forum | Tue Jul 25 03:10:05 EDT 2006 | reypal
If your Test tech able to analyze and tell you which exact ball/location is the problem, you may send it for cross section analysis and see how the solder connection behaves. also pls check your ESD implementation.
Electronics Forum | Wed May 25 21:03:30 EDT 2011 | thanhnguyen22
Hi All, I am new the PCBA process fabrication. I have found many cracks in the PCB after we have cross sections analysis. The cracking has same kind of pattern. It happens betwen the solder and the PCB, or between the solder and the part, BUT not be
Electronics Forum | Wed Apr 16 13:19:13 EDT 2003 | Takfire
Thanks Russ! The origianal complaint from the customer was in regards to what appeared as "bumpy" appearance and "holes" in the solder fillet. This problem was originally presented as an appearance issue only. Further investigation by our DPA lab r
Electronics Forum | Thu Oct 24 12:09:31 EDT 2002 | slthomas
Have you looked at cross-sectional analysis? If they can provide you details of where the failures are occurring, maybe you can chop one up and see exactly what's going on? We've done it once for our own engineering department and the results (not
