Electronics Forum | Thu Jan 15 03:20:59 EST 2009 | sachu_70
Hi Andrzej, I guess you mean peelable solder resist. Good idea to try during R&D, but certainly not a solution on production floor. Also, few constraints to be considered such as presence of entrapped air between component and solder resist, the natu
Electronics Forum | Tue May 20 03:21:05 EDT 2008 | grayman
I sell wave solder optimizer in Philippines. I have sold many of this optimizer system. It cost less than US$10K. Most of my customer is happy with the performance except for some issues from customers like LCD not yet colored, uses RS232, upgrades
Electronics Forum | Wed Jul 14 07:47:41 EDT 2004 | pcbrown
I am looking for effective ways to secure through-hole components (non-clinched) to the boards for wave soldering. Can someone share their ideas or methods? We've tried vacuum packing & tacking/masking, but there must be better ways. I'd appreciate a
Electronics Forum | Thu Nov 08 16:02:28 EST 2007 | ck_the_flip
We've got lots of connectors at my place of employment like this. What I do is... I run these "slower than molasses in January" - we're talkin' 2 Ft/Min. conveyor speeds. Obviously this will have an effect on your thermal profile so compensate acco
Electronics Forum | Wed Jul 03 14:08:10 EDT 2002 | gbriceno
I' designing a PCB with SMD components to optimize the land patterns for wave soldering. I find that the IPC-SM-782 land patterns are not robust enough for wave soldering, yielding ramdom skips and bridges. This PCB will also give me insight on sha
Electronics Forum | Thu Dec 29 09:20:30 EST 2005 | Cmiller
We have tested SN100C and SAC305 in our selective solder machine (Ersa Versaflow). We wanted to test both alloys in the selective first because the investment in filling the pots is minimal. In our initial tests the SN100C alloy appears to be the bes
Electronics Forum | Thu Nov 08 09:51:09 EST 2007 | rgduval
Where are the shorts occurring on the 96 pin connector? Are they consistently in the same areas? It looks as though there are a number of pins connected by traces on the board, and/or the ground plane. This would cause a lot of repeatable shorts i
Electronics Forum | Wed May 09 10:40:10 EDT 2001 | davef
First, your primary side component pads should be designed according to SM-782A, "Surface Mount design & Land Pattern Standard". Next if you did that and your secondary side component pads are the same size as your primary side components, your diff
Electronics Forum | Mon Jan 31 12:24:24 EST 2000 | Dave F
Robert: Several points: 1 Dross is a mixture of various things with no "fixed" composition: � The obvious things are metal oxides mixed with metal and this can vary in color with temperature and composition - remember some intermetallic oxides form
Electronics Forum | Mon May 07 12:11:33 EDT 2007 | colormaker
I have the option of increasing the wave pump but when I do the wave is very unstable. Do you have the possibility to create a backflow at the wave to drain the oxides away from the board? Not sure how to do this I wish I have the old 1962 7' holl
