Electronics Forum: de panel process for flex circuit (Page 1 of 3)

Re: Black hole process (MacDermitt) for PCB fab

Electronics Forum | Tue May 30 21:09:30 EDT 2000 | Dave F

Dennis: Direct metalization is more of an European phenomena than a US one. Not to say that good things don�t come out of Europe. As background: Direct Metallization. In circuit board fabrication, an alternative to electroless plating makes the

Ultrasonic washing for boards

Electronics Forum | Mon Apr 25 02:25:32 EDT 2005 | Mike Konrad

The issue of using ultrasonic technology for post reflow de-fluxing presents challenges in two categories: Controversial: Although there are recent studies that indicate acceptance with ultrasonic technology on populated assemblies, there remains si

Ultrasonic washing for boards

Electronics Forum | Mon Apr 25 16:25:07 EDT 2005 | Mike Konrad

Hi Carl / Bill, I seem to miss your point regarding disclosure. As I CLEARLY stated, it is the perception of damage more than the possibility of damage. As a twenty year veteran of de-fluxing systems, I can assure you that there remains enough con

Books for SMT

Electronics Forum | Tue Jan 16 20:34:17 EST 2007 | davef

DAVE�S BOOKSHELF ASSEMBLER�S ESSENTIALS Title: Soldering in ElectronicsAuthor: RJ Klein WassinkPublisher: Electrochemical PublicationsISBN: 090115024XPublication date: December 1989 I know, I know. The book was written in 1989!!!! I use this b

Solder print for TAB Bonder

Electronics Forum | Thu Apr 13 13:02:03 EDT 2000 | Paul Peterson

Hi fellow problem solvers,... We suspect a planarity problem with our 6 mil wide flex circuit pads having height variance of up to 2 mils after print and reflow. This is contributing to a placement skew with our TAB bonder... Has anyone had any succe

Argon Tank for Plasma Treatment

Electronics Forum | Fri Nov 03 13:58:25 EDT 2017 | mattmunoz2013

Hello, I am currently in the process of purchasing a plasma chamber for the purpose of activating the surface of flex circuits so that they bond more readily. In addition I need to purchase a gas cylinder for the chamber, specifically one that is a

Reference Standard for Plasma Etching or Scrubbing on Flex Ckts

Electronics Forum | Fri May 14 11:17:42 EDT 2004 | Ashok Dhawan

I am having coating adhesion problem with flex circuits. The cover plate material is KAPTON or Poly imide. The conformal coating material used is humiseal 2A64. The boards are cleaned, measuring less than 4 microgram Nacl per sq in. against acceptabl

Re: Mil 50884 Qualification for Flex/Rigid Flex - Help !

Electronics Forum | Wed Sep 30 10:38:42 EDT 1998 | Earl Moon

| Anyone have ideas how to get MIL 50884 Qualification?. | | We are a small/mid sized Flex, rigid-flex circuit shop in Canada considering MIL Qualification. Is there any web site that we could check out? | | any advice is appreciated. | thank

Optimizer software for different brand of Pick and place equipme

Electronics Forum | Wed Aug 29 10:10:46 EDT 2007 | ed_faranda

Panasonic Flexi-Cam is supposed to support different types of equipment (including third party). Not sure if it will support AX-72, if they don't, you could ask. I know they support a range of Universal Equipment. Back in the day, when PanaPRO woul

Re: Criteria for the Omega Mete from Alpha Metals Inc.

Electronics Forum | Mon Jan 08 20:57:52 EST 2001 | Dave F

Are you talking about bare board cleanliness or assembly level cleanliness? Bare board cleanliness is still primarily measured by resistivity of solvent extract (ROSE) using instruments such as Omegameters and Zero Ions. What is considered as "acce

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de panel process for flex circuit searches for Companies, Equipment, Machines, Suppliers & Information

Midwest Circuit Technology
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