Electronics Forum | Wed Mar 18 13:21:26 EST 1998 | Earl Moon
| Cpk's on top flight ovens (e.g., Conceptronics, Heller, Electrovert, Vitronics) vary wildly, from 1 to 2+, between different supplers. The suppliers don't seem to understand Cpk's. A supplier's rep whose oven has a Cpk of 1.0 told me: | 1. Cpk's
Electronics Forum | Wed Feb 25 01:24:34 EST 1998 | Steve Gregory
Dave, I confess I was a tad too general and a bit too extreme describing the way ALL solder joints look on palladium coated leads. I should been more specific about the "pillow-effect". I've seen it regularly with palladium coated leads on small SOT
Electronics Forum | Wed Jan 14 08:24:07 EST 1998 | Allison
Good luck in your conquest. I have been struggling with the same issues for some time now. I have made the following conclusions. First, it is nearly impossible to establish parameters in SMT to perform X-Bar and R charts. Electronics is not as cl
Electronics Forum | Fri Aug 10 13:28:19 EDT 2001 | Hussman
Hey John, You're not alone, a lot of people have the same problem with different machines and material. What is your specific problem, just keeping SPC control? Or are your defects at the wave from the glue too? If it's a process problem, I found
Electronics Forum | Thu Sep 13 13:29:06 EDT 2001 | mparker
Dave et al, I just print out and read a copy of the aforementioned recommended article. Mr. Mangin gives a clear picture of why DPMO is to be considered a more pure data than First Pass Yield (FPY). However, I must note that his interpretation of h
Electronics Forum | Wed Sep 19 14:23:31 EDT 2001 | jschake
Pad Metallurgy Used: Copper OSP pads were used for all of the results that I have been reporting. The same design test boards with Nickel/Gold pads are available and awaiting further assembly tests. I will consult with a board technology and metall
Electronics Forum | Fri Sep 21 14:03:45 EDT 2001 | jschake
I have observed solder balling for all aperture sizes tested. Solder balling levels appear to be better correlated against the amount of solder paste that is underneath the 0201 component terminations after placement rather than comparing this to th
Electronics Forum | Tue Oct 16 07:00:06 EDT 2001 | genglish
Hi all, I have a problem and would gratefully take on suggestions, firstly let me explain the situation: We are currently screen printing adhesive, using a method similar to DEKs 'Pump Print', The adhesive we are currently using is supplied from Alp
Electronics Forum | Wed Oct 24 18:10:56 EDT 2001 | davef
We attended several presentations on AOI machines at a recent SMTA meeting. The presenters gave a section about process verification. They bantied about numbers. [I want to say 350 DPMO, but we glaze over when it gets to that stuff] So, you might
Electronics Forum | Wed Nov 07 17:13:51 EST 2001 | fmonette
Hany, The guidelines for proper handling and storage of moisture sensitive components, like PBGAs are clearly documented in the joint IPC/JEDEC standard J-STD-033 (free download at http://www.jedec.org). In short you need to keep track of exposur
.png)
