Electronics Forum: die attached (Page 1 of 8)

Die attach with solder paste

Electronics Forum | Fri Aug 30 06:18:55 EDT 2002 | seje

Thanks Jim, that should help. And yes, there is light at the end of the tunnel.... now : ) -Sasu-

wirebonding

Electronics Forum | Fri Aug 14 11:01:43 EDT 2020 | charliedci

Looking for someone who can perform die attach, wirebonding and gloptop services on small quantity of SMT assemblies in the US.

Chip Die Damage

Electronics Forum | Fri Dec 07 09:54:05 EST 2012 | davef

Try MIL-STD-883 Method 2017 Die inspection service providers may be willing to help Services, Die inspection * Amkor amkor.com * Syagrus Systems syagrussystems.com SMTA has published a lot of papers that track to 'die' & 'inspection' but most oft

Die attach with solder paste

Electronics Forum | Tue Aug 27 03:45:36 EDT 2002 | seje

Hi there. We are considering to attach die chip with solder paste to the pcb at the SMD line (we are used to attach it with silver epoxy at the die bonding line before). This is a whole new method to me, so I'd like to have some opinions here. Where

Re: Photonic Soldering

Electronics Forum | Wed Sep 20 10:00:40 EDT 2000 | Erick Russell

Yes, some testing of soldering chip capacitors onto ceramic substrates with high temperature paste proved successful. Die attachment can be achieved using this technology as well. The underfill of the die becomes a critical factor in rework potentia

What's The Resolution?

Electronics Forum | Mon Jun 18 18:17:10 EDT 2001 | davef

What to you consider to be the minimum resolution [micron] for: General, BGA, die attach uBGA, flipchip, wire bonds Wire cracks, delamination Microcircuit failure What is the relationship between resolution [micron] and the kV of the tube?

What is the QFN or Device Voiding Levels Needed for Automotive Industry for Power Devices for Electric Vehicles?

Electronics Forum | Wed Mar 15 11:51:35 EDT 2017 | cyber_wolf

Rob, I believe that is for die attach voiding not solder interface.

Where can i find Chip-on-board Forum?

Electronics Forum | Tue Jan 09 22:04:48 EST 2007 | Guest

Set Up Guy, I am not sure if the COB you are refering to means Circuit on Board . If yes, this process also include SMT . Package is a combination of some passive components and bare die. Passives are normally attached thru SMT using solder te

What's The Resolution?

Electronics Forum | Tue Jun 19 18:15:22 EDT 2001 | davef

What do you mean when you say "structure"? Taking a different tact to get at an answer to the original question, if applications such as general, BGA attach, and die attach inspection require a resolution of 10 units. What would you suggest are the

Re: What is the typical BGA substrate pad alloy

Electronics Forum | Fri Dec 03 18:17:12 EST 1999 | Dave F

Dave: There's lots of stuff on the web describing BGAs. Examples are: http://www.smtnet.com/bookstore/publications/0speckdo1/s1.html http://www.smtnet.com/bookstore/publications/0shutcco1/ch1p2.html http://www.citizen-america.com/OEM/bga/process

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