Electronics Forum | Tue Jun 04 19:33:16 EDT 2002 | rob_thomas
Dave's estimation is pretty conservative but there is a lot of equipment out there and a lot of people happy to make a sale.Implementing both mentioned processes it's difficult and time consuming .Even if you get good training from whoever sells you
Electronics Forum | Mon May 07 22:29:52 EDT 2001 | davef
4 wire per sec ... you figure how many you need] Encapsulation ~$120K for a dispenser [10 sec per die ... you figure how many you need] plus a cure oven ~$100k Throw in a another ~$100k for marking and cleaning Check the September 2000 SMTnet New
Electronics Forum | Wed Jul 15 08:36:41 EDT 2020 | dproldan
Using a X-Rays machine, we have noticed that one component we are using has the silicon die bonded at an angle in the package. Have you ever seen something like this? I'm not sure if it's intentional or a manufacturing error.
Electronics Forum | Wed Jul 29 16:04:03 EDT 2020 | emeto
Very interesting. Looking at the wire bonding, it seems that it is all normal.
Electronics Forum | Fri Jul 17 21:54:18 EDT 2020 | davef
That is unusual. Is it a once-off or SOP for that part?
Electronics Forum | Wed Jul 29 14:55:41 EDT 2020 | philc
Maybe check with the manufacturer? I am sure they would know if this was normal. And does the PCB function as expected? If it does, maybe not an issue....
Electronics Forum | Wed Mar 29 18:17:16 EST 2000 | David
Does anybody out there have experience building electronics assemblies with DCA (Direct Chip Attach - bare die onto PCB) and wire bonding? - What Die Bonder/Dispensing Machines are recommended? - What brand conductive epoxy were used to attach die?
Electronics Forum | Wed Dec 14 20:17:48 EST 2016 | davef
As I understand, you are wire bond gold wire to gold pad, where the substrate has good bond strength, but the die does not. If bond quality is good, and then drops off rapidly, then it's probably something to do with contamination within the system
Electronics Forum | Tue Aug 27 03:45:36 EDT 2002 | seje
Hi there. We are considering to attach die chip with solder paste to the pcb at the SMD line (we are used to attach it with silver epoxy at the die bonding line before). This is a whole new method to me, so I'd like to have some opinions here. Where
Electronics Forum | Wed Jan 27 11:22:51 EST 2010 | fredc
Hello TQS, We have made Micro Mechanics adapters for Mydata. The Micro Mechanics tips are used in die bonding machines. I have no doubt that an adapted nozzle would hold your die securely. From Grants posts in the past, he had problems with placement
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