Electronics Forum | Mon Apr 26 09:18:15 EDT 2010 | sudhir14
Hi, friends Need your urgent help on bellow issue ....... we are facing issue of misalign of one bulky SMT transformer during the placement itself rejection @40% & after reflow rejection @5 % using SMT m/c QP242 , placing this component at end of al
Electronics Forum | Fri Dec 03 18:01:56 EST 1999 | M Cox
Usually the alignment problem comes from pad design. The ground pad (largest) is too small. If that is the case (and even if it isn't) try placing a dot of SMT adhesive before placement (it will cure before reflow and hold the part in place). Goo
Electronics Forum | Sat May 08 07:03:31 EDT 2010 | aj
From looking at your images I would say it could be poor solderability on the terminations of the component itself. Can you get your hands on a different date code and try them out?
Electronics Forum | Fri Apr 30 00:20:33 EDT 2010 | sudhir14
We are using QP fuzi m/c during the placement of comp. PCB is fixed & placement head is movable This component is placed at last but still we are getting the problem Comp. is placed with slowest setting also slowest comp. transfer speed of nozzle h
Electronics Forum | Wed May 05 15:27:06 EDT 2010 | bradlanger
Make sure that both lead frames are contacting the PCB pads when the part is on the placement head. We had an SM xfrmer that we were handling with vacuum by a ferrite cap that was not glued on straight. The part would contact one set of pads and get
Electronics Forum | Fri Apr 30 07:39:54 EDT 2010 | jdengler
We do a similar part on a Fuji IP3. Set table speed to low. I do not know the QP, but if it's similar to the IP make sure the board clamp/unclamp is smooth. On our IP it got dirty and was jerking causing the board to jump a little which bounced ou
Electronics Forum | Sun May 02 11:36:27 EDT 2010 | jdeluna
I do agree with Jerry: you should apply more paste on it, either with a step stencil, or doing overprint on it by, let's say 120% on Transformer's pad. Also, you need to check : a) there's smooth movement on transport process after the placement, no
Electronics Forum | Mon Apr 26 15:48:04 EDT 2010 | markhoch
Sudhir, This part appears to have a lot of mass, thus it may be very heavy. What type of placement machine are you using? Is the PCB held in a fixed place on the table while the gantry moves in the X and Y? Or does the PCB move in the X and Y while t
Electronics Forum | Mon Dec 06 17:50:39 EST 1999 | Kantesh Doss
Christopher: Thank you for sharing your experience about the DPAK. Yes, out part has a heat sink at the bottom. Our stencil opening was 7 mils (in both X and Y) smaller than the pad size excepting that the stencil opening consisted of a series of zeb
Electronics Forum | Tue Jul 24 17:54:14 EDT 2012 | tombstonesmt
Anyone placing any type of masking material die cuts with SMT equipment? We currently manually place a enormous amount of polymide 1/4 inch dots. Looking into automating this process. We already place 2d labels so doesn't seem to far fetched. Any sug
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