Electronics Forum | Mon Jul 27 13:59:11 EDT 1998 | Robert Steltman
We are about to run our first BGA devices and would appreciate some confirmation on a few points. First some details: PCB & Device: ============= 1) 16 layer (4 power, 4 gnd, 8 signal) 2) gold on nickel finish 3) ceramic BGA with eutectic balls Refl
Electronics Forum | Tue Jul 28 02:13:57 EDT 1998 | Bob Willis
There is a procedure for profiling on my web site that may be of use to start with www.bobwillis.co.uk | We are about to run our first BGA devices and would appreciate some confirmation on a few points. | First some details: | PCB & Device: | ======
Electronics Forum | Tue Jul 28 02:22:59 EDT 1998 | Bob Willis
Here is what I would do faced with your problem. First I would profile a similar board or use an existing profile. From there I would place the dummy device on the surface of a sample board with a thin thermocouple soldered to the board surface under
Electronics Forum | Tue Jul 28 09:15:49 EDT 1998 | Justin Medernach
| We are about to run our first BGA devices and would appreciate some confirmation on a few points. | First some details: | PCB & Device: | ============= | 1) 16 layer (4 power, 4 gnd, 8 signal) | 2) gold on nickel finish | 3) ceramic BGA with eutec
Electronics Forum | Tue Jul 28 17:23:58 EDT 1998 | Robert Steltman
| | We are about to run our first BGA devices and would appreciate some confirmation on a few points. | | First some details: | | PCB & Device: | | ============= | | 1) 16 layer (4 power, 4 gnd, 8 signal) | | 2) gold on nickel finish | | 3) ceramic
Electronics Forum | Thu Nov 30 23:31:49 EST 2000 | CAL
Dave F- FYI SMFL3000 is a manual placement/ reflow machine from Dima SMT (WWW.DIMASMT.com)origin, the Netherlands. In the USA Manncorp Reps Dima. I would reflow each IC component by itself and do an isolated mass reflow on the chips, then run to a s
Electronics Forum | Wed Dec 10 16:58:53 EST 2014 | sreejhu
Hello, yes you are absolutely correct. I agree with your point. Last week,I personally checked out my board on Heller 1088 which is a 8 zone reflow oven (4 on top and 4 on bottom) and the soldering came pretty nice. So comparing with that situation
Electronics Forum | Thu Dec 11 09:27:16 EST 2014 | sreejhu
ALso, coming to the convection the DIMA service group said : "Its full convection in the top zones. The bottom zones are heating elements mounted underneath a thick aluminium plate. So not full IR, but the head is coming from the heated aluminium p
Electronics Forum | Wed Dec 10 15:27:14 EST 2014 | sreejhu
Thanks for your reply!! But i dont understand the 300 degree is okay to for lead free process
Electronics Forum | Thu Dec 11 11:00:36 EST 2014 | sreejhu
Hello, So in short, i wanted to know.. for 8 zones i guess that will be a great deal. and the machine made year is 2000. Also, coming to the max. thickness of PCB we have is 0.085 inches.
