Electronics Forum | Fri May 21 15:50:41 EDT 1999 | John Thorup
We are running a number of boards with 8-10 25 mil PQFPs on board. Our process is mature with at least 3 years experiance and statistically few opens on the QFPs. Our beloved purchasing department has chased the almighty $ and changed FAB vendors
Electronics Forum | Sun May 23 15:12:59 EDT 1999 | JohnW
| We are running a number of boards with 8-10 25 mil PQFPs on board. Our process is mature with at least 3 years experiance and statistically few opens on the QFPs. Our beloved purchasing department has chased the almighty $ and changed FAB vendor
Electronics Forum | Mon May 24 13:33:46 EDT 1999 | Dave F
| We are running a number of boards with 8-10 25 mil PQFPs on board. Our process is mature with at least 3 years experiance and statistically few opens on the QFPs. Our beloved purchasing department has chased the almighty $ and changed FAB vendor
Electronics Forum | Wed Sep 12 17:57:29 EDT 2001 | CyberVilla
Cal, I can only respond by saying that the question relates to one important word "Reliable". If you feel that you have found the special touch to provide accurate and repeatable results, then I applaud your hard work. Also, a counter attack by co
Electronics Forum | Thu Jan 20 08:08:24 EST 2011 | deanm
Because we build Class 3 assemblies, our company has formal inspection steps on our routes. CCA's go through surface mount and then an operator inspects the solder joints for defects and corrects them (touch-up). Following this they go to formal insp
Electronics Forum | Thu Apr 27 11:50:21 EDT 2006 | samir
90% of the battle with thermal profiling is your thermocouple attachment. That is Process Engineering 101. It's just like painting your house. The masking and prep work will make or break the end result. KIC did a DoE on which thermocouple attach
Electronics Forum | Thu Jul 12 10:32:59 EDT 2001 | Hussman
Wow, what a string of answers and nobody brought up the easiest way to eliminate solder balls. Yes, the paste being squished under the part does reflow and work it's way out to the side during reflow. I did a 5 week study on this (when I was a bori
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
Electronics Forum | Thu Oct 29 21:16:15 EDT 2009 | mah115
Fellows, We are considering getting an AOI machine to inspect boards that our vendors are giving us (we outsource the assembly of PCBAs). We have low volumes of boards, but every time a defect does slip by our human inspectors, it causes a lot of
Electronics Forum | Fri Apr 27 11:24:53 EDT 2007 | realchunks
Hi Steve-O, Good question(s). This process was set-up by an engineer that had a PhD in statistics, took him a year to develop and then thru it over the wall at us. The biggest problem we saw was SPC to measure solder volume. SPC is good for measu
