Electronics Forum | Tue Jan 31 12:02:22 EST 2006 | aj
how would you apply both pastes.? anyway, I have succesfully run leadfree bga with lead paste. You gotta find a profile that kinda meets both requirements. Taking into consideration the peak temp and time above. dont have details on hand but I ca
Electronics Forum | Tue Aug 22 16:02:07 EDT 2000 | Dr. Ning-Cheng Lee
If the thermal mass of the products is small, a tent-shaped profile is recommended, with peak temperature around 240C. The hottest spot on board should be less than 250C. However, if the thermal mass of the product is large, such as a large server PC
Electronics Forum | Thu Sep 05 23:18:03 EDT 2013 | feiyangniao
There is a new toy I received today: a NeoDen TM-240A automatic desktop pick and place machine! I’ve kept my eyes on this baby for a quite a while, and finally decided to make a purchase last week. The shipping was very fast: DHL from China, a total
Electronics Forum | Fri Aug 26 14:15:16 EDT 2005 | David
Where could I find more information regarding the double sided reflow and flux problems with white tin?
Electronics Forum | Wed Aug 31 12:33:25 EDT 2005 | Jaya
I have expirence running,double sided Imm gold boards recently which ed up a lot of solderability issue. The Imm gold need to be slightly more control during reflow oven area on it's profile.
Electronics Forum | Wed Feb 09 18:22:20 EST 2005 | mrduckmann2000
Valerie, Thank you for your reply. I have a quick question......when you converted to a double reflow process did you have any thru-hole parts on the assembly. If so how did you handle them....pin and paste? Thanks, mike
Electronics Forum | Fri Oct 30 10:17:05 EDT 2015 | esoderberg
You don't say how many headers you have to solder. I usually spec in High temp headers and use a pin-in-paste methodology and double reflow. Can you get your headers high temperature?
Electronics Forum | Thu Jul 06 13:36:37 EDT 2006 | SWAG
We've had much trouble with flex circuits. As previously mentioned, you must have local fids for the board or the BGA itself (if panelized). Other troubles we experience are drilled holes for pinned connectors. Unless the PCB manufactur has some w
Electronics Forum | Wed Feb 16 14:47:04 EST 2005 | Valerie
Mike, To answer your question, Yes we have thru-hole parts on the boards that we converted to double-sided reflow, we use pallets to select solder the leads. I suppose Masking would work, but that's using a lot of mask. Can I ask, whats preventing
Electronics Forum | Wed Feb 09 12:28:58 EST 2005 | Valerie
We have been pretty successful with screen printing glue, however the smallest component we now glue is a 0805. We had many problems using our Gemini II to put down glue dots for a 0603, so we altered the pads to do double-side reflow. As our own int
