Electronics Forum | Mon Mar 16 16:58:51 EDT 2009 | Charlie D
We evaluated several rework machines a few years ago and decided on the Finetech CRS-10. It outperformed the Airvac DRS25 machine. We didn't bring in the Focal Spot because it uses IR. The Focal Spot System does not have a solder removal option and
Electronics Forum | Mon Mar 09 11:22:44 EDT 2009 | pcbrown
There are several out there. We will be doing some proprietary BGA installation in-house and I need a rework station. Has anyone had any experience with Focal Spot RD-500? Air-Vac DRS25? Or is there a better system out there for occasional to light u
Electronics Forum | Fri Mar 13 16:38:57 EDT 2009 | hegemon
'Hege is checking in for the DRS25 by Air Vac. Forced Air Convection reflow, and huge heating capacity for bottom side, ensuring minimum Delta T across the PCB during the process. Have 3 of these machines constantly in use for the last 2 and a half
Electronics Forum | Sun Apr 25 10:28:46 EDT 1999 | Joe Cameron
Hello all, Been doing some comparisons on joints made using the soldering iron versus reflowed solder paste (on a QFP package). The difference is quite significant: the joints made by the soldering iron are inconsistent and in many cases not filled
Electronics Forum | Thu Jun 01 21:59:10 EDT 2000 | Ray Chartrand
Does anyone know the current cost to repair a defective solder joint? I seem to recall a number quoted a few years ago of $1.03 per joint with burden of overhead. I've also seen numbers from 50 cents to 50 dollars per joint.
Electronics Forum | Fri Nov 09 10:25:43 EST 2001 | steven
is it all right to reflow a BGA using a rework station but without applying a layer of solder paste on pcb. the diameter of the solder ball is 0.75 and the pitch is 1.5mm.
Electronics Forum | Thu Apr 01 11:27:17 EST 2004 | Jimmy
I have some fine pitch QFP's to rework with our smt rework system (forced air). There are no intitial concerns in removing the component (we havent actually begun the rework process) however, installing a new chip presents a problem. The QFP has
Electronics Forum | Mon Mar 19 08:26:37 EST 2001 | hany_khoga
Dear All: We have a problem of soldering big BGA's (3.5Cm * 3.5 Cm)during rework or repair. With three big companies stations (hot air & infrared) with their support, they faild to re-solder even one BGA succesfully. Note that we workes on a good te
Electronics Forum | Thu Apr 01 12:05:21 EST 2004 | babe
Heat guns scare me, hot air scares me too. Just the heck of it why not apply high temp paste to the center and eutectic 63/37 standard solder to the outside pads. The outside reflows first allowing proper seating of the component and with a proper pr
Electronics Forum | Fri Nov 09 16:57:27 EST 2001 | davef
Sure, it�s fine to use the proper amount of flux and no solder when reworking BGA. Recognize that these new solder connections have less metal and a lower standoff than similar BGA solder connections that have not been reworked. This undoubtedly
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