Electronics Forum | Mon Feb 05 10:12:32 EST 2007 | slthomas
The use of booties isn't required per se, just considered a standard step necessary to reach the 10,000 target. You also need to vacuum (central vac system, NOT exhausting into the room) daily, mop weekly, have a one piece floor, blah, blah, blah....
Electronics Forum | Wed Jan 24 22:48:59 EST 2007 | frank63
Hello, we are facing some troubles with BGA opens in our production. PCB are both side popolated with BGA. BGA is array of 26*26, with some 6*6 center balls. PCB has 2 reflow processes, 4 pcs of BGA on each side. Now we are partly observing opens
Electronics Forum | Wed Feb 28 12:34:21 EST 2007 | rob_thomas
Every component has a "how to order" paragraph in their data sheet with specific suffixes,letter/digit combinations that reflect each parameter of that part including packaging, lead finish etc. So if you order using the manufacturer p/n you are alm
Electronics Forum | Mon Mar 19 05:51:24 EDT 2007 | pima
Hello I made some test on different oven and problem still occurs. The only progress is that with diffrent thermoprofil ( Ramp to Spike instead of Ramp- Soak- Spike skewed components appears at 1 % of produced parts). With Ramp - Soak-Spike we have p
Electronics Forum | Tue Apr 03 05:46:35 EDT 2007 | chrissieneale
OK - going to set up some measurements so we can see how big this problem is. I've got the following so far... Number of boards pasted per employee per shift Number of hand placed parts per employee per shift Number of people per shift Time pasting
Electronics Forum | Tue Apr 03 13:10:15 EDT 2007 | slthomas
Personally I wouldn't count anything but minutes. You need to know how long it takes to perform each task in order to balance your line. What I'm gathering is that you've got one printer feeding 4 machines, all running different jobs or maybe a pai
Electronics Forum | Fri Apr 06 10:43:57 EDT 2007 | flipit
Hi, Anyone seeing difficulty is soldering MLFs or QFN with lead free solder? I have an MLF with 3 rows of pads on each of the 4 sides of the part and then the large center ground plane in the middle. The part is 20 mil pitch. Had good luck with l
Electronics Forum | Mon Apr 09 14:53:19 EDT 2007 | flipit
Hi, We were running with few defects with lead solder paste. The lead solder paste with stencil 0.010" X 0.020" and 0.004" thick stencil produced near defect free PCB assys. 0.010" X 0.020" (0.004" thick) lead = defect free 0.010" X 0.020" (0.005"
Electronics Forum | Tue May 08 10:39:42 EDT 2007 | realchunks
Well, in manufacturings defense, I have to say we LIKE our AOI. We run preset-up jobs that are scanned in by the operators. The bar code on each reel is placed there from incoming. Incoming is a very, very busy place. From time to time we find th
Electronics Forum | Thu Apr 26 10:07:06 EDT 2007 | realchunks
Hi Dub J, I have worked for a few companies that did 3D sampling and found the data they produce to be useless. In the real world they are slow, so that means you won't sample every board. Now if you're not sampling every board, and you start to r
