Electronics Forum | Wed Jan 09 11:09:53 EST 2002 | slthomas
Is anyone still using Loctite 348 chipbonder for bottom side attachment? Is it truly adequate for dispensing up to 18k/hour? We will be dispensing with a Camelot 2800, so somewhere in the neighborhood of 15k/hr. is as fast as we'll ever see. I'm c
Electronics Forum | Tue Jan 15 06:05:37 EST 2002 | Romain
Dear all We have since few weeks problems with BGA solder joint integrity on ENIG finish. Under relatively very flexible of the FR4, the joint breaks between ball and PWB. When we take off the BGA for analysis, some of the pads seem very flat, totaly
Electronics Forum | Tue Jan 29 15:48:31 EST 2002 | davef
On his site "SMT In Focus", our friend Brian Sloth Blitzen lists the following sampling of lead-free [no lead] links: * Alpha Metals: http://www.alphametals.com/lead_free/index.html * Circuits Assembly magazine: http://www.circuitsassembly.com/db_ar
Electronics Forum | Mon Feb 04 20:27:25 EST 2002 | davef
1,000 G ohm ||100 M ohm Dielectric Constant ||9.5 ||4.9 Loss Factor ||5 - 20 ||200 * E indicates exponent Continuing: * Spacing between same plane traces effect the electical parameters between the traces. * Dielectric materials used between diff
Electronics Forum | Tue Feb 19 14:00:55 EST 2002 | global
We have had some discussions about what causes parts to lift out of the holes when going over the wave on our flow solder machine. The machine being used is a Treiber (700 series). There are two bottom pre-heaters and one top pre-heater. We try to pr
Electronics Forum | Thu Apr 04 16:38:51 EST 2002 | davef
Equipment companies like to talk about �accuracy� and �repeatability�. These measures provide limited information. Flaws of the measure aside, some printer companies have begun to report Cp. * DEK ELA: Cp = 1.33 @ �0.025mm * DEK 265: Cp = 1.6 @ �0.0
Electronics Forum | Fri Apr 05 13:42:05 EST 2002 | dougt
We have been using a silicone encapsulated, high flex, flat cable for a short time now and have not been succusfull in terminating it to connectors with shell housings designed for round cable. Our solution thus far has been to leave the housing off
Electronics Forum | Thu Apr 11 19:06:59 EDT 2002 | tmarc
We are using 1mm pitch BGAs with a great quantity of via(s) under the component. Very shortly we will be placing CSPs with .65mm pitch. Our via(s) are solder masked, however we generally have a percentage of them that the masking is thin enough that
Electronics Forum | Tue May 14 13:18:33 EDT 2002 | Scott B
I think what David was getting at was, as an example. Take a cubic inch of gold. Surface area = 6 sq/in. Volume = 1 cu/in. Water displacement = X. Mass = Y Roll that cube of gold out to a micron thick. Surface area = football pitch. Volume = 1 cu/i
Electronics Forum | Thu Jun 06 07:28:30 EDT 2002 | cyber_wolf
It has been my experience that the only thing(s) that will ever cause this is: 1. Operators with paste on their hands. 2. Paste on the screen printer tooling. 3. Paste on the bottom of the stencil. Even very very small amounts of paste on the gold fi
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