Electronics Forum | Thu Sep 16 12:06:29 EDT 1999 | Scott S. Snider
| | | Hi, | | | | | | Can someone pls suggest to me the best reflow temperature setting | | | for a force air convection oven. The details is as follow. | | | 1) Heller 1700s | | | 2) 12 zone---6 top and 6 bot | | | 3) Solder paste --- Qualitek 691
Electronics Forum | Fri Feb 28 10:32:45 EST 2003 | pjc
Cookson Electronics Equipment- Electrovert AquaStorm 200 highly recommended options: Checkmate Conveyor Hurricane Jets in Wash and Rinse 4 Additional Top Spray Bars in Wash *Closed Loop Filtration System for Wash *Positive Displacement Chemical Meter
Electronics Forum | Thu Jan 17 20:33:05 EST 2002 | ianchan
Hi, Can anyone help explain the benefits/disadvantages of bareboard pcb baking, as part of the pre-heat conditioning, before the bareboard pcb use in SMT production run? The pcb board is 200mm x 240mm panelized pcb board, and has 28 smaller pcb boa
Electronics Forum | Wed Oct 06 08:41:42 EDT 1999 | Dave F
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Wed Oct 06 00:26:04 EDT 1999 | Karlin
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
Electronics Forum | Wed Oct 06 23:36:28 EDT 1999 | karlin
| | | Hi, | | | | | | Help! Could anyone help to enlighten me on this? | | | | | | Question: | | | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z
Electronics Forum | Wed Oct 06 12:03:12 EDT 1999 | Graham Naisbitt
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Fri Oct 08 02:31:07 EDT 1999 | Brian
| | | | Hi, | | | | | | | | Help! Could anyone help to enlighten me on this? | | | | | | | | Question: | | | | | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowab
Electronics Forum | Wed Oct 06 11:40:41 EDT 1999 | Debbie Alavezos
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Wed Oct 06 03:58:25 EDT 1999 | Brian
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
| 1 |
winsouce.jpg)
