Electronics Forum | Tue Feb 11 07:35:03 EST 2020 | dontfeedphils
If all else fails, you can always chipbond the part. Would it be possible to run this side as the second reflow?
Electronics Forum | Wed Feb 12 07:25:47 EST 2020 | dontfeedphils
If you have control of the solder alloy you're able to use on the product, you could run a lower temp solder on the second side and try to avoid the first side entering reflow.
Electronics Forum | Wed Feb 12 10:11:05 EST 2020 | emeto
Would you consider a light reflow pallet on second side holding the connetors in place and preventing them from moving?
Electronics Forum | Wed Feb 12 10:17:15 EST 2020 | emeto
Would you consider a light reflow pallet on second side holding the connectors in place and preventing them from moving?
Electronics Forum | Tue Feb 11 04:08:51 EST 2020 | majdi4
we have a problem : The connector is falling down in the second reflow. This connector is mounted in the first side. You can find attached the reflow profil we work with and a photo of the connector. We tryed with under_film but the connector is sti
Electronics Forum | Wed Mar 24 17:09:34 EDT 2010 | davef
RE Search: Search can be tricky. Try MSD and wash
Electronics Forum | Mon Feb 24 01:40:05 EST 2020 | sarason
Traditionally these connectors are riveted to the board on higher volume telecommunication applications. sarason
Electronics Forum | Wed Feb 12 08:10:49 EST 2020 | majdi4
We can't do that because we are using dual ligne reflow oven..So the two sides of PCB are soldered with the same reflow profil.
Electronics Forum | Thu Mar 25 09:27:08 EDT 2010 | stepheniii
Thanks I guess I got used to google where the "and" is implied. I searched various combinations and all I could find were threads regarding the pcb's not the components. Does anyone bake their boards after wash before second reflow because of MSD c
Electronics Forum | Wed Mar 24 16:54:38 EDT 2010 | stepheniii
J-STD-033B.1 Says "For cavity packages in which water may be entrpped, water clean processes after first reflow can be an additional source of moisture. This may present an additional risk, which should be evaluated." And it talks about derating if
