Electronics Forum | Wed Feb 05 15:16:15 EST 2003 | davef
If the voiding is not related to entrapped air in your vias, consider trying a different paste.
Electronics Forum | Sun Aug 28 09:23:52 EDT 2005 | davef
Sara Rice: How did you determine the balls were entrapped?
Electronics Forum | Fri Jun 05 17:36:39 EDT 2009 | gsala
what do you think about Moisture entrapped into BGA or PCB before reflow ? regards GSx
Electronics Forum | Tue May 23 22:23:20 EDT 2000 | JAK
Hi all, I'm would like to try intrusive reflow (pin in paste, paste in hole, etc.) on a connector using WS-609 solder paste (halide free, water-washable). I'm concerned about entrapped flux in the barrel of the solder joints. If there were to be e
Electronics Forum | Tue May 23 22:21:13 EDT 2000 | JAK
Hi all, I'm would like to try intrusive reflow (pin in paste, paste in hole, etc.) on a connector using WS-609 solder paste (halide free, water-washable). I'm concerned about entrapped flux in the barrel of the solder joints. If there were to be e
Electronics Forum | Tue Jun 06 11:57:12 EDT 2006 | Chunks
IPC 610 says acceptable Class 1 (Class 2, 3 indicator) if they are entrapped/encpsulated balls within 0.13mm of lands or pads. or exceed 0.13mm in diameter. Defect Class 1,2,3: Solder ball violates min electrical clearance. Solder balls not entrap
Electronics Forum | Tue Feb 16 12:14:12 EST 1999 | Gregg Reick
| Hope some of you out there can help me with this one. | I am getting feedback from our test department that they are showing opens on solder joints which have visually good wetting. The touch-up operators confirm that the joint looks good. All they
Electronics Forum | Thu May 25 17:18:45 EDT 2000 | Boca
I have not done pin in paste in production quantites, but speculation is always a blast so; OA fluxes are active at room temperature, they grow 'fur' with humidity if not washed off, great stuff for soldering, nasty stuff for reliability (if not rem
Electronics Forum | Mon Jun 11 22:00:19 EDT 2001 | davef
IPC-A-610 uses words to the effect that it�s a Class 2 process indicator, if either: * Entrapped or encapsulated solder balls that are within 0.13 mm [0.00512 in] of lands or connectors, OR * Entrapped or encapsulated solder balls exceed 0.13mm [0.00
Electronics Forum | Fri Nov 02 12:01:26 EST 2001 | mparker
I have two cases where I must bake after DI wash. The moisture entrapment is specifically within microprocessor sockets. Without air gun blow out and baking, oxidation occurs that causes flaky contacts for the PGA. We will bake for 2-3 hours @ 60C. O
