Electronics Forum | Wed Oct 04 14:46:46 EDT 2000 | Kal. Chak.
Hi folks, What are the differences between Epoxy resin(ER)conformal coating and adhesive stacking/bonding material? My PSA/PRA (Post solder/reflow assembly)bracket assembly process got some ER adhesive encroachment on pads/solderjoints. I have chec
Electronics Forum | Sun May 21 09:38:25 EDT 2006 | davef
Epoxy Removal and IC Delidding [Hardware Hacking: Have Fun While Voiding Your Warranty, Chapter 14] Encapsulation of critical components using epoxy or other adhesives is commonly done to prevent tampering and device access (the microprocessor shown
Electronics Forum | Wed Jul 18 08:44:20 EDT 2012 | leeg
We use the Edding pen as stated but then apply a quick set epoxy resin over the top and allow to dry, this does work.
Electronics Forum | Wed Nov 17 09:02:57 EST 1999 | Dave F
John: The 180 Tg point is a sweet spot for obtaining heat resistance, cost effectivly. These high technology boards provide good thermal resistance for wire bonding, direct chip attach, and BGA mounting and rework. Since these boards are harder th
Electronics Forum | Tue Aug 25 17:49:15 EDT 1998 | Earl Moon
| Hello, | Our PWB supplier has requested that a change in the laminate material to reduce the incidence of pad lifting. The standard laminate materials (Polyclad PCL-FR-226 with a glass transition temperature of 135 C) have greater z-axis thermal e
Electronics Forum | Mon Aug 09 18:03:28 EDT 1999 | Earl Moon
| | I am having cleaning problems when processing PCB's which have | | TAIYO solder mask on them. After processing, hand soldering and | | cleaning, a sticky residue is remains, resulting in a cosmetically poor finish with tide marks etc. Other solde
Electronics Forum | Tue Aug 10 16:01:12 EDT 1999 | Earl Moon
| | | | | | I am having cleaning problems when processing PCB's which have | | | | | | TAIYO solder mask on them. After processing, hand soldering and | | | | | | cleaning, a sticky residue is remains, resulting in a cosmetically poor finish with tid
Electronics Forum | Wed Jun 07 20:21:26 EDT 2000 | Dave F
Point well taken John. Expanding on epoxies: Novolac is a multifunctional epoxy ... a phenolic resin. Most phenolic resins are made using phenol (P) and formaldehyde (F). They comprise the bulk of IC packaging and are divided into two classes:
Electronics Forum | Wed Jun 07 21:07:07 EDT 2000 | Dave F
Ooooops, I messed that up!!!! It should read: Point well taken John. Expanding on epoxies: Novolac is a multifunctional epoxy ... a phenolic resin. Most phenolic resins are made using phenol (P) and formaldehyde (F). They comprise the bulk of
Electronics Forum | Wed May 19 11:50:32 EDT 1999 | Chris Nuttall
We care currently running into problems during our plug via process: At the moment we plug prior to soldermask (LPISM) using epoxy resin - plugging takes place from the component side - however we are seeing solderballs after solder level.This is cau
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