Electronics Forum | Tue Oct 17 17:27:08 EDT 2006 | adlsmt
Define "pretty easily". Did anyone ever do whatever is making them fall off now before? In most casses where a component "falls off" then someone implements a totally subjective test to make sure the rest of the parts wont "fall off" they damage a lo
Electronics Forum | Tue Oct 17 15:31:29 EDT 2006 | TM
I've got some MELF packages that reflow and connect but later fall out of the solder pretty easily. We are not using epoxy but, the parts have fillets per IPC standards. We have not looked at cross-sectioning for IMC and don't plan to at the moment
Electronics Forum | Wed Oct 18 08:00:53 EDT 2006 | davef
Have you tested the solderability of the inbound components per ANSI/J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals, and Wires?
Electronics Forum | Tue Aug 11 09:52:53 EDT 2015 | rgduval
I assume that these parts are falling off during second-side reflow? The easy solution, of course, is to not build high-mass components on first-side reflow. If this isn't practical, however, you can try using epoxy/glue under the component. We'
Electronics Forum | Mon Jun 14 11:44:10 EDT 1999 | Vince Gedgaudas
Has anyone had issues where bottomside double reflowed smt has fallen off in the wave when using voc-free flux? I have verified the hotter profile was not the issue by using an alcohol based flux with no problems.This voc-free flux is also not causin
Electronics Forum | Tue Jun 15 12:03:27 EDT 1999 | Dave F
| Has anyone had issues where bottomside double reflowed smt has fallen off in the wave when using voc-free flux? I have verified the hotter profile was not the issue by using an alcohol based flux with no problems.This voc-free flux is also not caus
Electronics Forum | Wed Aug 30 00:16:15 EDT 2000 | Craig
We are reflowing ceramic resonators and are finding their tops falling/popping off when handling the pcbs during final assy. The epoxy seems to be coming off the components base and adherring to the lid. The components are "RFM resonators", case type
Electronics Forum | Thu Feb 14 04:38:43 EST 2008 | marjorie
Anyone knows why BGA fell off sometimes from the board? I was running in a single sided only. I encountered a BGA falling off from the pcb pad. The pcb is ENIG and lead free process. The pads had no solder and didn't looks like having a black pad thr
Electronics Forum | Thu Feb 14 07:34:10 EST 2008 | jdumont
How many fell off out of your entire lot? What was the soldering quality like on the ones that didn't fall off (xray, visual)? You need to determine if its a random problem or if even the ones that stayed on are barely on and go from there. If the o
Electronics Forum | Tue Feb 11 10:51:20 EST 2020 | slthomas
To predict whether or not a first pass part is going to come off during the second pass you need to calculate the ratio of weight/soldered surface area. According to a couple of different sources that I've dug up, maximum is around 44 grams/in.^2. I
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