Electronics Forum | Tue Oct 04 20:18:17 EDT 2011 | denmark
Sir *We are using "HOT BAR SOLDERING" we are bonding "FFC" and "PCB" at 0.5mm pitch. Machine settings: Heating Temp. 310º, Colling Temp. 190º Delay Time 1sec We also using "BECKLITE" as Soldering Jig that can resist up to 400º. We are using 1 is to
Electronics Forum | Thu Jan 26 02:07:33 EST 2012 | denmark
Sir i need someones expertise on my problem. We are running repair unit which we conduct FFC removal in this process we are encountering big problem by whick we lessen solder deposit on our PCB.. 1. Can you give me some idea on what way can we put a
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