Electronics Forum | Mon Sep 29 14:47:15 EDT 2008 | davef
Let's narrow this down. Questions are: * Are you putting the proper amount of solder in the board with your stencil print process? * If you are putting the proper amount of solder in the board, where is the solder going? Pick one and then fill-in th
Electronics Forum | Thu Nov 07 09:56:26 EST 2002 | bpan
Thanks for the ideas guys. My QC inspector can take a pick and move the back part of the lead....even though the front of the lead is soldered enough to hold. There is SOME NOT ALL areas where there is no solder on the curved portion of the lead.The
Electronics Forum | Wed Sep 18 12:31:16 EDT 2002 | dragonslayr
My suggestion is to conduct a Design For Manufacturing (DFM)study on the assembly in question. Pay particular attention to the pad sizes, component lead dimensions and satisfy yourself that those two factors are correct. Given that pads match compone
Electronics Forum | Wed May 17 14:02:06 EDT 2006 | russ
So, what is the pitch of the part and the pad size, also tell us the thickness of stencil. Russ
Electronics Forum | Wed May 17 13:48:37 EDT 2006 | dwelch123
I'm having trouble printing leads on a fine pitch part. The lead is only .008". I'm using a DEK 265 with metal squeegee and using WS200 multicore solder paste.The stencil is laser cut and polished. I've experimented with different pressures and diffe
Electronics Forum | Sat Jun 18 00:35:15 EDT 2005 | mskler
Thanks to all. I am working on your suggetions will get back as the problem solved
Electronics Forum | Thu May 18 12:00:42 EDT 2006 | jdengler
I think he edited his original post.
Electronics Forum | Thu May 18 11:16:16 EDT 2006 | russ
Go 5 or 6 mil thick with stencil, i am not familiar with that pitch but I would recoomnd a 5mil. Was the thickness in this post before and i missed it? Russ
Electronics Forum | Thu May 18 09:18:33 EDT 2006 | Chunks
Hi dwelch123, 8 mils seems a bit thick to me. I would normally go 6 or 5 mil for fine pitch such as this. One other area to check is the the snap off. Are you using the slow snap off or just lowering the board right after print? If so you should
Electronics Forum | Thu Jun 16 09:13:46 EDT 2005 | russ
We use a 5 mil for 16mil pitch QFPs, Make sure that the stencil has been polished. Type 3 paste. We have used lead free no-clean, lead no-clean, and water soluble lead pastes for these packages. We set the printer for a slow stroke .7 in/min. wi
winsouce.jpg)