Electronics Forum | Thu Aug 01 12:36:44 EDT 2024 | simonalden
We've just taken delivery of a used Viscom S3088 flex from our sister company in Germany but the operating manuals are all in German! Viscom wouldn't help unless we enrolled for training. Does anyone have any relevant pdfs he can send over please?
Electronics Forum | Tue Jun 16 11:04:11 EDT 2015 | cyber_wolf
Who are the experts in the U.S. regarding polyimide bare board manufacturing ? We are struggling with warpage issues....
Electronics Forum | Thu Mar 05 16:25:27 EST 1998 | Brian Stumm @ ETS
| I am looking for information on reflow temps for a flex board. There is only one 6 pin IC but the board has a 3M double sided tape. | Is it possible to reflow without damaging the tape. Any suggestions? Do you have a profiler for your reflow oven?
Electronics Forum | Fri Jan 07 01:20:03 EST 2000 | Dennis O'Donnell
Try calling Rick Zaki at (408) 847-0150. Tell him Dennis O'Donnell refered you. Rick is an independent rep that reps several fab companies with different target markets. I use him for all of my sub contract fab and he gets me best quality and best
Electronics Forum | Tue Mar 21 17:44:45 EST 2006 | omar_verdugo
hi all, could someone have an idea, would it be the best method to attach a flex cable to a pcb. right now, we are using a hot bar to solder the flex to the pcb, but we are having troubles with this method. the process is no regular all the time a
Electronics Forum | Wed Dec 22 21:14:53 EST 2004 | davef
IPC-FA-251 recommends 121*C for 30-60 minutes for 1 and 2 flex layer circuits. A rigid flex can take easily an hour per layer depending on the construction.
Electronics Forum | Wed Jul 01 13:57:07 EDT 2015 | circleprime
I have a customer that is requesting their flex circuit be conformally coated. Is this something that is done? Which coating would stand up to the stresses of flexing? Wouldn't that put stress on the components? Thanks! Shannon
Electronics Forum | Wed Dec 22 18:09:07 EST 2004 | kmorris
At a previous job I had been taught that when reflow soldering polyimide flex circuits, it was necessary to pre-bake them before reflow soldering to prevent delamination. Our procedures said that there must be a 1hr bake prior to reflow, and the flex
Electronics Forum | Sat Mar 06 08:45:16 EST 1999 | Dave F
| I need advise on how can bonding of ICs to flex foil be done. | The pitch of bonding is between 70 to 100 microns and the foil thickness is from 25 to 35 microns. | | Anyone, please enlighted what kind of bonding technology (thermo-sonic maybe), a
Electronics Forum | Wed Jan 05 17:53:52 EST 2005 | SuePH
We had a contract in house that included a flex board which required an 18 hour bake at 105 degrees. The other brds got along fine with 2 hours, but the flex board would delaminate until we went to this long bake. I don't know how the engineer came