Electronics Forum | Thu Apr 10 19:19:01 EDT 2003 | stevemoore
Are you gluing the parts to the board? We had a similar situation where the glue beneath the component would add a 'fulcrum' point to the center of the device and when the board flexed the part would fracture.
Electronics Forum | Mon Apr 13 09:27:28 EDT 2009 | hxr6038
We had an issue with the finish, PCB manufacturer is telling that they had a problem with the Nickel rework, which resulted in 20% fall out. Please help me by providing the ENIG thickness for Flex boards, is it same as rigid boards as per IPC 4552. I
Electronics Forum | Tue Aug 13 01:44:19 EDT 2002 | kenbliss
This problem is the number one reason the electronics industry has moved the handling process of PC boards to the tray and tray cart handling process. It eliminates flexing of boards and therefore stops board damage ie. broken circuits and micro fra
Electronics Forum | Mon Dec 26 13:24:12 EST 2005 | mariss
I'm assuming the fracture in tension; the fracture doesn't show even at X50. The broken edges are that clean. I would expect spalling at the fracture edges if it were a compression or torsional fracture. This makes me belive the board expands and pul
Electronics Forum | Wed Aug 04 11:01:46 EDT 2010 | ooskii
I have a question concerning what plating will go into solution during the reflow process. I am soldering a small piece of ceramic (120x180 mils 7 mil thick) onto a flex circuit. I am seeing some fractures that I am sure are being caused by handlin
Electronics Forum | Mon Aug 28 17:16:32 EDT 2006 | Board House
Being the Lead free material would be more fragile it would have more of a tendency to fracture the material. I have had a customer run into this issue, they have not came across a cure yet. Hitting the upper tolerance might be the cure I will sugges
Electronics Forum | Fri Dec 20 17:09:52 EST 2019 | slthomas
I agree, that is not a gullwing lead in the normal sense but that doesn't address the failure. The wetting looks fine unless there is a problem under the lead, which is hard to tell since there is an obvious fracture. That appears to be the edge o
Electronics Forum | Thu Oct 24 14:10:53 EDT 2002 | Terry Burnette
I've been informed that I can't post the Dye Penetrant paper on the SMTNET library till Advanced Packaging releases the paper in their Dec. issue. You should be able to pull a copy in the next couple of weeks from their site, http://ap.pennnet.com/ho
Electronics Forum | Fri Oct 09 13:37:55 EDT 2009 | tstrat
We are seeing similar issues. We have a board that consistently has failures on a BGA part. After SEM/EDS it was shown that the fractures were occurring between the Ni-P and Ni-Sn intermetallic in the ENIG finish. The element map showed elevated conc
Electronics Forum | Tue Jun 20 14:19:04 EDT 2000 | Chrys Shea
Hi Mike, The Hadco design guidelines are really good - I was just there. To expand on what Dave said, scoring is an option, but I've never had good luck with it, myself. The scores are either too shallow, and I can't break the boards easily enough
.gif)
