Electronics Forum | Wed Sep 23 20:38:30 EDT 1998 | parag
does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap.
Electronics Forum | Thu Sep 24 13:17:34 EDT 1998 | Dave F
| does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap. Parag: Check the link bel
Electronics Forum | Thu Sep 24 07:43:12 EDT 1998 | Earl Moon
| does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap. Characterization means det
Electronics Forum | Fri Jun 01 14:50:29 EDT 2001 | Matt Gormont
I am looking for outline tolerances of a flip chip with a pitch of .25mm. Bumps are made of 63/37 solder. Key tolerances are bump height and positional tolerance of the bumps. Can anyone HELP?
Electronics Forum | Thu Feb 12 21:30:45 EST 2004 | davef
Comments are: * We're amazed that you can thermocompression bond to epoxy. * Silver may be oxidizing during expoxy cure. * Klein Wassink talks about aging in THE BOOK [Soldering in Electronics: A Comprehensive Treatise on Soldering Technology for Sur
Electronics Forum | Wed Feb 11 09:07:37 EST 2004 | Ashok Thiyagarajan
HI I am currently having a wafer which is stud bumped (Au), I am printing conductive adhesives (with silver fillers) on the pads , and by thermocompression bonding, I am establishing the connnection between. But right now the problem is the silver
Electronics Forum | Tue Jun 10 15:47:18 EDT 2014 | hegemon
Possibly the components have been re-taped in that particular reel, with only electrical function in mind? Hard to see a nozzle causing a flip, and I am thinking if your feeders are vibrating bad enough to flip the components in the tape, that you
Electronics Forum | Mon Mar 09 15:53:05 EST 1998 | Tom Foley
| I am looking for component placer that can handle not only smc but also flip chip C4. | If there is any machine satisfying my request, please inform me. | machine name , spec, and so on. Take a close look at the Philips ACM. The ACM is engineere
Electronics Forum | Fri Feb 20 20:08:18 EST 1998 | Chang Woo Cho
I am looking for component placer that can handle not only smc but also flip chip C4. If there is any machine satisfying my request, please inform me. machine name , spec, and so on.
Electronics Forum | Tue Jun 10 14:04:08 EDT 2014 | rway
Perhaps neither. I assume the part is T&R. It's flipping inside the tape before placement. I don't know how the nozzle could be doing it. There could be excess vibration on the feeder which is causing the part to flip. Just a thought.
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