Electronics Forum | Mon Feb 28 09:21:08 EST 2005 | Dave G
UIC has a nozzle specifically designed for 0603's. (UIC P/N 46937042) That's what I've been using with better results than the 08mpf. Even the 08 will overhang the part some. We place 0603's on pretty tight centers so I need a nozzle that wouldn't ov
Electronics Forum | Tue Mar 01 09:20:42 EST 2005 | rlackey
I remember Metro Nozzles mentioning that they are bringing out a new "blade" nozzle soon to allow closer density placement of 0402's & 0603's than the 08MPF allows. Also noticed that you get far better placement with a 1 mil camera than a 4 mil, coz
Electronics Forum | Thu Feb 24 11:07:04 EST 2005 | cisridn
I need information on where I can purchase Lead free solder paste and solder wire samples. I currently use SN63/PB37 no clean solder paste in a 35G tube and SN63/PB37 no clean solder wire for rework. I would like to try out some samples of Lead fr
Electronics Forum | Mon Feb 28 08:34:46 EST 2005 | Alex
Good advises thanks. I'll go thru all nozzles and vacuum check today and tell the programer about PD's and nozzle vs shutter. Should I check at the same time all the vacuum filter ? For the placement test, we use the same feeder at the same position.
Electronics Forum | Tue Mar 01 10:27:24 EST 2005 | Rob
Hi Alex, I've seen 2 types of feeder test rigs for sale that cover CP6 feeders, one from Alternative - http://www.alternativesmt.co.uk and one called a GAM20 - I think it was ABtech Europe - http://www.abtech-europe.com. The GAM20 was about half th
Electronics Forum | Thu Feb 24 13:52:16 EST 2005 | deyo
I have a quad vmp20b benchtop printer that keeps blowing out the table up\down control FETS. Anybody have any idea what component is before or after these fets that could be causing this? I metered all the surrounding components nothing was out of t
Electronics Forum | Fri Feb 25 10:46:50 EST 2005 | John S
We are developing a new product, and some of the designers are proposing QFN packages. These look like leadless QFP's. We don't currently use anything like this, but we operate in a high reliability automotive market. Can anyone provide advice/com
Electronics Forum | Wed Mar 02 05:01:41 EST 2005 | ABHI
Are your packages mounted on boar using sockets or BGA balls? LGA's are usually no issue and are simple compared to BGA. No issue on missing balls or ball drop issues. However, LGA's need quite a bit of mounting / holding pressures during test and mo
Electronics Forum | Fri Feb 25 11:37:17 EST 2005 | OverTheHill
I believe I read somewhere, that using leadfree solder in the wave, the dross will actually collect in the bottom of the solderpot. I can't remember where I read this (maybe a nightmarrish dream I had one night). If so, how do you remove it from the
Electronics Forum | Fri Feb 25 18:13:17 EST 2005 | davef
Your leadfree dross should float, similar to your leaded dross. It's possible you're thinking about the process for removing excess copper from the solder pot. Following the same process, with: * Leaded solder, the copper floats. So, you scoop the
