Electronics Forum | Thu Jun 20 16:59:57 EDT 2002 | davef
We look at gluing and pasting second side components as two different processes, NOT alternative processes. Given our drothers, we'd paste / place / reflow all day long, before we'd want to glue. We glue because we have to glue. The main driver to
Electronics Forum | Wed May 14 10:20:37 EDT 2014 | julianf
Hello all! For my mechanical engineering study I want to etch a strain gauge in the Wheatstone bridge configuration in a copper layer of an PCB. The goal is to measure the strain occurring in an PCB even during the press process! We can measure with
Electronics Forum | Thu Sep 10 12:40:27 EDT 2009 | davef
1*10E9~11] that you reference? What are the units of this number?
Electronics Forum | Tue Sep 22 01:05:07 EDT 2009 | rohitfast
Thnaks for the input.
Electronics Forum | Thu Sep 10 06:28:17 EDT 2009 | rohitfast
1*10E9~11. Pl confirm me about the ESD requirement of this process. How i will ensure that process is ESD safe?
Electronics Forum | Tue Nov 03 09:32:57 EST 2009 | valeo
Hi all, I'm today looking for adhesive specifications on SMT process (by printing). The Glue printing process is new in my company, and I need info, please!!! Do you know specifications about Shear component value with gluing process (on component
Electronics Forum | Thu Sep 10 11:47:44 EDT 2009 | mikesewell
The adhesive should be a dielectric (insulator) by design, if not it could possibly short across leads of the very parts it's intended to secure. It normally isn't a concern - what is the surface resistance of your soldermask, bodies of ICs, ...etc.
Electronics Forum | Tue Sep 22 08:55:31 EDT 2009 | stepheniii
Second, ESD-stuff > IS very confusing. Largely because people don't > know what they're talking about. I think a lot of that is because of followers following followers.
Electronics Forum | Thu Sep 24 00:42:37 EDT 2009 | rohitfast
Can you pl let us know what was the ESD sensitivity level of your assembly? We are also using plastic stencil from last 3 years and not seeing any major diffficulties in our class-3 product.
Electronics Forum | Tue Sep 22 23:43:46 EDT 2009 | rohitfast
Hi Stephen, Can you pl suggest what exactly needed for the process? There is no any standard method to ensure for the ESD damage. ESDS:2020 is talking about only for persoanl and equipement grounding mechanism, in the process no insulator should be
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