Electronics Forum | Sun Jan 30 21:56:05 EST 2000 | Paulvannan
We used Promosol Sn96.5/Ag 3.5 during our initial qualification for similar application. We could not achieve a shiny solder joint. Our changes to Sn95.5/Ag 4.5 does not improve the look. In order to confirm the reliability of the joint, I suggest yo
Electronics Forum | Thu Jan 27 14:49:53 EST 2000 | Glenn Robertson
Tuan - One of the reasons I suggested pre-tinning (aside from the negative effects of Gold on appearance and reliability) is the known slower wetting of Sn/Ag and Sn/Cu alloys as compared to Sn/Pb. If you don't have to be Lead-free, the high Lead
Electronics Forum | Fri May 28 17:30:35 EDT 1999 | Dave Clements
I discovered that we have some gold plated (30 mico in.) through hole connectors which were Paste In Hole soldered (60 sec at reflow) on a HASL PCB. Do we have an embrittlement reliability issue? The calculated volume % of gold in the joints is about
Electronics Forum | Fri May 28 17:44:51 EDT 1999 | Glenn Robertson
| I discovered that we have some gold plated (30 mico in.) through hole connectors which were Paste In Hole soldered (60 sec at reflow) on a HASL PCB. Do we have an embrittlement reliability issue? The calculated volume % of gold in the joints is abo
Electronics Forum | Tue Oct 27 10:40:32 EST 1998 | Greg Curler
| I know that this not surface mount, but many of us have to perform multipule duties. Can anyone give me some information on this I am having problems getting relibility | getingthe heat seal ribbon to make consistant electrical contact. | Any help
Electronics Forum | Sat Oct 24 23:30:59 EDT 1998 | Pete Sorenson
| I know that this not surface mount, but many of us have to perform multipule duties. Can anyone give me some information on this I am having problems getting relibility | getingthe heat seal ribbon to make consistant electrical contact. | Any help
Electronics Forum | Mon May 06 20:21:36 EDT 2002 | ianchan
Steve, Hi mate, are you blokes using NC flux paste? or WS paste?
Electronics Forum | Mon May 06 00:09:00 EDT 2002 | ianchan
as a followup thought, what is your current peak reflow deg-C? and reflow timing (sec)? Au/Ni calls for reflow temperature of 217 deg-C for solder fusion that produces secondary eutectic alloy. there was one time we thought 183 deg-C was the magic
Electronics Forum | Fri May 03 18:10:17 EDT 2002 | stownsend
Okay, here goes another thread about gold plating. I have been using gold plated PCB's for about two years now, with mostly very good results. The main reason I started using gold in the first place was because it is flat, solder wets to it nicely,
Electronics Forum | Fri May 03 19:02:41 EDT 2002 | davef
Several of the points you make are reinforced in the fine SMTnet Archives. Consider searching them for bedtime reading, until the responses start flowing.
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