Electronics Forum: gold-tin contnet analysis (Page 1 of 1)

Silver Sulphide Contamination of Resistors

Electronics Forum | Wed Feb 21 19:55:12 EST 2001 | davef

References on corrosion are: * "ASM Corrosion Handbook No. 13" [0871700077]. * "Electronic Packaging and Corrosion" ME Nicholson [0871702916]. Please explain how you determined that you have silver-sulfide contamination. Where is the silver comin

Problems with TI DSP modules

Electronics Forum | Wed Oct 24 18:08:02 EDT 2001 | davef

1- DF1: WOW!!! How do people get these cool toys? CB: I am with the University at Buffalo Electronic Packaging Lab. http://www.packaging.buffalo.edu We have pretty much everything that is sold on the market as well as Laser inspection technologies we

Re: BGA problem: open after reflow

Electronics Forum | Wed Jan 17 20:48:14 EST 2001 | davef

We find that the raw BGA's pad sheared surface has the SnPb solder at various Z heights whereas the assembled BGAs pad leave a smooth layer of SnPb along the pad. Like to understand the cause for the difference. Who could guess? Solder joint streng

Re: BGA problem: open after reflow

Electronics Forum | Thu Jan 18 21:52:24 EST 2001 | arul2000

>>>>Dave, The BGA substrate surface finish is NiAu, while the PCBA pad surface is HASL. The solder ball composition is SnPb 63/37 and the solder paste used on the PCBA is also the same but with 2% Silver.>>> Dave, sorry I don't have the picture with

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